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Molecular dynamics simulation of liquid Cu during isothermal solidification

  • Rong Shan Wang*
  • , Huai Yu Hou
  • , Guo Liang Chen
  • *Corresponding author for this work
  • University of Science and Technology Beijing
  • Suzhou Nuclear Power Research Institute Co., Ltd.
  • Nanjing University of Science and Technology

Research output: Contribution to journalArticlepeer-review

Abstract

A series of molecular dynamics simulations for the structure transformation of liquid Cu during isothermal solidification were performed with the Tight-binding potential. Static structural information on the pair distribution functions and the coordination number distribution at different temperatures were obtained while an analysis was carried out on the possible change of short-range ordered structure of FCC crystal and its resultant types of atom pairs by means of the Honeycutt-Anderesen pair analysis technique. The results indicate that the 1551 bonds change into the 1541 bonds during solidification process and the formation of initial three-dimensional structure depends mainly on the diffusion and relaxation of Cu atoms in two directions.

Original languageEnglish
Pages (from-to)1127-1131
Number of pages5
JournalBeijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing
Volume31
Issue number9
StatePublished - Sep 2009
Externally publishedYes

Keywords

  • Isothermal solidification
  • Liquid copper
  • Molecular dynamics simulation

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