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Molecular dynamics simulation of a rigid sphere indenting a copper substrate

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Abstract

Three-dimensional molecular dynamics (MD) simulation is used to study the atomic-scale indentation process of a spherical diamond tip in contact with a copper substrate. In the indentation simulations, the force-displacement curve is obtained and compared with a modified elastic solution of Hertz. The contact area under different indentation depths is also investigated. The force-displacement curve under different maximum indentation depths is obtained to investigate elastic-plastic deformation during the loading and unloading processes.

Original languageEnglish
Title of host publicationASME/STLE 2012 International Joint Tribology Conference, IJTC 2012
Pages293-295
Number of pages3
DOIs
StatePublished - 2012
Externally publishedYes
EventASME/STLE 2012 International Joint Tribology Conference, IJTC 2012 - Denver, CO, United States
Duration: 7 Oct 201210 Oct 2012

Publication series

NameAmerican Society of Mechanical Engineers, Tribology Division, TRIB

Conference

ConferenceASME/STLE 2012 International Joint Tribology Conference, IJTC 2012
Country/TerritoryUnited States
CityDenver, CO
Period7/10/1210/10/12

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