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Molecular dynamic simulation of the effect of nanocoating on two-phase evaporative heat and mass transfer

  • Binjian Ma
  • , Li Shan
  • , Junhui Li
  • , Bans Dogruoz
  • , Damena Agonafer
  • Washington University St. Louis
  • Cisco Systems

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Two-phase cooling such as thin film evaporation is becoming increasingly popular for thermal management of high powered electronics due to the high latent heat associated with the phase change process. Nanoengineered surfaces have been shown to improve two-phase heat transfer performance through enhanced wettability and reduced interfacial thermal resistance. However, how interfacial resistance varies with surface wettability and how such resistance can affect thin-film evaporative transport is still not well understood. In this study, we investigate the evaporative transport characteristics and wetting state of an evaporating thin liquid film on both smooth and nanocoated surfaces using Molecular Dynamics (MD) simulations. The surface wettability between liquid argon and silicon (100) surface coated with 0, 1, and 3 layers of graphene is characterized using equilibrium molecular dynamics methods. The associated interfacial thermal resistances and the evaporation rates are explored using non-equilibrium molecular dynamics methods, in which a hot and cold solid substrate are implemented to facilitate the evaporation and condensation of liquid argon molecules.

Original languageEnglish
Title of host publicationProceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
PublisherIEEE Computer Society
Pages226-231
Number of pages6
ISBN (Electronic)9781728124612
DOIs
StatePublished - May 2019
Externally publishedYes
Event18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 - Las Vegas, United States
Duration: 28 May 201931 May 2019

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2019-May
ISSN (Print)1936-3958

Conference

Conference18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Country/TerritoryUnited States
CityLas Vegas
Period28/05/1931/05/19

Keywords

  • Argon
  • Graphene
  • Interfacial Thermal Resistance
  • Thin Film Evaporation
  • Wettability

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