@inproceedings{32603c91bc6a437383ffe67b551c6f95,
title = "Moir{\'e} method for nanoprecision wafer-to-wafer alignment: Theory, simulation and application",
abstract = "The two dimensional (2D) moir{\'e} centrosymmetric grating is developed to assist realization of high-precision wafer-to-wafer alignment and non-destructive measurement of misalignments for wafer bonding. Using these moir{\'e} patterns the misalignments in the order of ± 64 nm in X-Y axis can be resolved by a simple IR microscopy (5x objective) images. This value can be further improved to sub-10 nm range if the sub-pixel estimation is performed. For current status, the limit of the minimum resolved misalignment using moir{\'e} gratings is ∼0.2 nm according to theoretical analysis. It can be applied for not only the future 3D integration of wafer-scale, but also the fabrication of 3D nanostructures and advanced lithography techniques.",
author = "Chenxi Wang and Tadatomo Suga",
year = "2009",
doi = "10.1109/ICEPT.2009.5270759",
language = "英语",
isbn = "9781424446599",
series = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",
pages = "219--224",
booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",
note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",
}