TY - GEN
T1 - Moiré-Based Nanoprecision Bonding Alignment System for Hybrid Integration
AU - Qi, Xiaoyun
AU - Yan, Han
AU - Zhou, Shicheng
AU - Kang, Qiushi
AU - Wang, Chenxi
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - Wafer bonding alignment is one of the most important manufacturing processes in 3D integration, especially in high-density interconnection. A nanoprecision alignment system based on moiré fringes suitable for both optical transparent or opaque advanced wafers is proposed and named MoiréView. Moiré fringes are sensitive to gratings superposition status and beneficial for improving the accuracy into the nanoscale. The alignment system, which contains optical part, mechanical handling part, and signal process part, is developed to align bonding wafers without transparency requirements. The alignment operation includes optical system calibration, wafer position recognition, and wafer alignment. Using the moiré-based alignment method, we believe the system developed has sufficient potential to be a versatile and efficient method for high-density new-generation 3D integration.
AB - Wafer bonding alignment is one of the most important manufacturing processes in 3D integration, especially in high-density interconnection. A nanoprecision alignment system based on moiré fringes suitable for both optical transparent or opaque advanced wafers is proposed and named MoiréView. Moiré fringes are sensitive to gratings superposition status and beneficial for improving the accuracy into the nanoscale. The alignment system, which contains optical part, mechanical handling part, and signal process part, is developed to align bonding wafers without transparency requirements. The alignment operation includes optical system calibration, wafer position recognition, and wafer alignment. Using the moiré-based alignment method, we believe the system developed has sufficient potential to be a versatile and efficient method for high-density new-generation 3D integration.
KW - 3D integration
KW - MoiréView
KW - moiré fringes
KW - nanoprecision alignment
KW - wafer bonding
UR - https://www.scopus.com/pages/publications/85124802016
U2 - 10.1109/ICTA53157.2021.9661731
DO - 10.1109/ICTA53157.2021.9661731
M3 - 会议稿件
AN - SCOPUS:85124802016
T3 - 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
SP - 24
EP - 26
BT - 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
Y2 - 24 November 2021 through 26 November 2021
ER -