@inproceedings{5e4f392fd44c4bbd869b39801c4ca997,
title = "Modeling thermal fatigue in anisotropic Sn-Ag-Cu/Cu solder joints",
abstract = "Properties of body-centered tetragonal β-Sn are highly anisotropic. The crystal orientation of the β-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The best Sn grain orientation is perpendicular to the solder/Cu interface.",
author = "Yang Shihua and Tian Yanhong and Wang Chunqing and Huang Tengfei",
year = "2009",
doi = "10.1109/ICEPT.2009.5270748",
language = "英语",
isbn = "9781424446599",
series = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",
pages = "288--289",
booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",
note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",
}