TY - GEN
T1 - MIV Fault Modeling Method Based on Finite Element Analysis
AU - Xiao, Ziwen
AU - Yang, Zhiming
AU - Yu, Yang
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - Compared with integrated circuits based on through-silicon vias (TSVs), Monolithic three-dimensional integrated circuits (M3D ICs) have higher integration and relatively superior electrical performance. However, monolithic inter-tier vias (MIVs) inside M3D ICs are prone to failure. Accurate MIV fault models can provide the basis for subsequent fault detection work. In this paper, a MIV fault modeling method based on finite element analysis (FEA) is proposed, and MIV fault models are established by FEA softwares. The proposed method has high precision and is beneficial to further improve the detectable fault range of MIVs.
AB - Compared with integrated circuits based on through-silicon vias (TSVs), Monolithic three-dimensional integrated circuits (M3D ICs) have higher integration and relatively superior electrical performance. However, monolithic inter-tier vias (MIVs) inside M3D ICs are prone to failure. Accurate MIV fault models can provide the basis for subsequent fault detection work. In this paper, a MIV fault modeling method based on finite element analysis (FEA) is proposed, and MIV fault models are established by FEA softwares. The proposed method has high precision and is beneficial to further improve the detectable fault range of MIVs.
KW - M3D ICs
KW - MIV fault model
KW - finite element analysis
KW - monolithic inter-tier vias
UR - https://www.scopus.com/pages/publications/85124809368
U2 - 10.1109/ICTA53157.2021.9661873
DO - 10.1109/ICTA53157.2021.9661873
M3 - 会议稿件
AN - SCOPUS:85124809368
T3 - 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
SP - 149
EP - 152
BT - 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
Y2 - 24 November 2021 through 26 November 2021
ER -