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Minimal twin structures enabling extraordinary thermoelectric power factor of n-type Bi2Te3 thin films

  • Haoran Ge
  • , Rui Cheng
  • , Wei Liu*
  • , Jiamin Qiu
  • , Sen Xie
  • , Zhaohui Wang
  • , Fan Yan
  • , Qiwei Tong
  • , Jiahong Cheng
  • , Tingting Su
  • , Yujie Ouyang
  • , Hao Sang
  • , Xianda Li
  • , Zhengfei Wei
  • , Jun Mao
  • , Yong Liu
  • , Huangshui Ma
  • , Min Hong*
  • , Dongwang Yang
  • , Ctirad Uher
  • Qingjie Zhang, Xinfeng Tang*
*Corresponding author for this work
  • Wuhan University of Technology
  • Harbin Institute of Technology (Shenzhen)
  • Wuhan University
  • University of Southern Queensland
  • University of Michigan, Ann Arbor

Research output: Contribution to journalArticlepeer-review

Abstract

Boosting carrier mobility is essential for achieving high room-temperature thermoelectric performance in n-type Bi2Te3-based films, which have long exhibited inferior power factors compared with their single crystal counterparts due to poor carrier mobility. To overcome this challenge, we develop a simple substrate surface engineering strategy to fabricate Twin-free n-type Bi2Te3 (000 l) thin films. Atomic-scale analyses and transport measurements uncover that eliminating twin structures avoids twin-induced band bending and severe lattice strain, enabling the simultaneously enhanced carrier mobility and suppressed bipolar conduction. The optimized Twin-free Bi2Te3 film exhibits a high room-temperature carrier mobility of ~279 cm2V-1 s-1, doubling the mobility of films containing twin structures, and consequently achieves an extraordinary room-temperature power factor of ~6.17 mW m-1 K-2. These findings highlight the critical role of minimizing twin structures in boosting the carrier mobility and mitigating bipolar conduction, thereby providing an effective route toward high-performance thermoelectric thin films.

Original languageEnglish
Article number6106
JournalNature Communications
Volume17
Issue number1
DOIs
StatePublished - Dec 2026
Externally publishedYes

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