TY - GEN
T1 - Microstructure of Sn-Ag-Cu lead-free flip chip interconnects during aging
AU - Zhou, Wenfan
AU - Tian, Yanhong
AU - Wang, Chunqing
PY - 2005
Y1 - 2005
N2 - In the electronic industry flip chip has been the primary technology used in chip interconnection process. Its tiny solder joint includes complicated structures such as Sn solution, eutectic mixture and Intermetallic Compounds (IMCs), whose mechanical performance is quite different from the original solder bulk. In this paper, the microstructure evolution of flip chip solder joints under thermal aging was analyzed. The results showed that with the aging time increasing, coarsening of solder bulk matrix and AuSu4 occurred, and large IMCs formed near the interface after aging for some time, but disappeared again when the aging continued. The interfacial morphology between IMC and solder bulk became more planar after aging. Influence of reflow times in butted bonding (as-bonded condition) on the characteristics of interfacial IMC is weakened as the process of aging going.
AB - In the electronic industry flip chip has been the primary technology used in chip interconnection process. Its tiny solder joint includes complicated structures such as Sn solution, eutectic mixture and Intermetallic Compounds (IMCs), whose mechanical performance is quite different from the original solder bulk. In this paper, the microstructure evolution of flip chip solder joints under thermal aging was analyzed. The results showed that with the aging time increasing, coarsening of solder bulk matrix and AuSu4 occurred, and large IMCs formed near the interface after aging for some time, but disappeared again when the aging continued. The interfacial morphology between IMC and solder bulk became more planar after aging. Influence of reflow times in butted bonding (as-bonded condition) on the characteristics of interfacial IMC is weakened as the process of aging going.
UR - https://www.scopus.com/pages/publications/33846276886
U2 - 10.1109/ICEPT.2005.1564656
DO - 10.1109/ICEPT.2005.1564656
M3 - 会议稿件
AN - SCOPUS:33846276886
SN - 0780394496
SN - 9780780394490
T3 - 2005 6th International Conference on Electronics Packaging Technology
SP - 427
EP - 431
BT - 2005 6th International Conference on Electronics Packaging Technology
PB - IEEE Computer Society
T2 - 2005 6th International Conference on Electronics Packaging Technology
Y2 - 30 August 2005 through 2 September 2005
ER -