TY - GEN
T1 - Microstructure evolution of 1100 Al alloy multi-foils during ultrasonic additive manufacturing
AU - Ji, Hongjun
AU - Wang, Junzhao
AU - Li, Mingyu
PY - 2012
Y1 - 2012
N2 - Multi-annealed 1100 Al alloy foils were welded to form monolithic samples using the ultrasonic additive manufacturing (UAM) process at room temperature. 40%, 60%, 80% of the oscillation amplitudes were investigated at 20 kHz frequency and a constant contact pressure. Deformed microstructures were analyzed using low-resolution electron backscattered diffraction (EBSD). Evolution of fine equiaxed grains from an initial coarser grain structure was observed in the volume of Al alloy foils, and the extent of the grain refinement is proportion to oscillation amplitude. Additionally, the orientation image maps (OIM), polar figures (PF), and orientation distribution functions (ODF) of the samples are obtained. The characteristics of the crystallographic orientation were analyzed to find the effect of ultrasonic amplitude on the microtexture of the matrix material.
AB - Multi-annealed 1100 Al alloy foils were welded to form monolithic samples using the ultrasonic additive manufacturing (UAM) process at room temperature. 40%, 60%, 80% of the oscillation amplitudes were investigated at 20 kHz frequency and a constant contact pressure. Deformed microstructures were analyzed using low-resolution electron backscattered diffraction (EBSD). Evolution of fine equiaxed grains from an initial coarser grain structure was observed in the volume of Al alloy foils, and the extent of the grain refinement is proportion to oscillation amplitude. Additionally, the orientation image maps (OIM), polar figures (PF), and orientation distribution functions (ODF) of the samples are obtained. The characteristics of the crystallographic orientation were analyzed to find the effect of ultrasonic amplitude on the microtexture of the matrix material.
UR - https://www.scopus.com/pages/publications/84875428343
U2 - 10.1109/ICEPT-HDP.2012.6474910
DO - 10.1109/ICEPT-HDP.2012.6474910
M3 - 会议稿件
AN - SCOPUS:84875428343
SN - 9781467316804
T3 - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
SP - 1586
EP - 1589
BT - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Y2 - 13 August 2012 through 16 August 2012
ER -