TY - GEN
T1 - Microstructure evolution and fracture mechanism of sintered nano-Ag joints on bare copper during high temperature aging
AU - Zhou, Qihang
AU - Yang, Fan
AU - Du, Zhipeng
AU - Du, Jianjun
AU - Li, Mingyu
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Low-temperature sintering of nanoscale silver paste in die-attached interconnection has been widely applied in the packaging of high-power devices due to its excellent electrical properties, thermal properties, and high melting temperature. Herein, we investigated the reliability of pressure-assisted sintered silver joints on bare copper during high temperature storage (HTS) tests in air at 300 °C. It was found that after aging for a period of time, the copper oxide phase appeared in the sintered silver layer as a semi-closed loop. We found the existence of oxygen under high temperature aging could expand the pore size and rise the porosity of the sintered Ag film, which might introduce the nucleation site of the Cu oxide. Based on this, the growth mechanism of copper oxides was discussed and the growth model of the semi-closed loop structure was proposed. We also found the semi-closed loop structure had a certain hindering effect on the intrusion of oxygen into the interior of the sintered silver, which slowed down the degradation of the strength of the sintered silver joint. The fracture mechanism of sintered nano-Ag joints during high temperature aging process was also studied.
AB - Low-temperature sintering of nanoscale silver paste in die-attached interconnection has been widely applied in the packaging of high-power devices due to its excellent electrical properties, thermal properties, and high melting temperature. Herein, we investigated the reliability of pressure-assisted sintered silver joints on bare copper during high temperature storage (HTS) tests in air at 300 °C. It was found that after aging for a period of time, the copper oxide phase appeared in the sintered silver layer as a semi-closed loop. We found the existence of oxygen under high temperature aging could expand the pore size and rise the porosity of the sintered Ag film, which might introduce the nucleation site of the Cu oxide. Based on this, the growth mechanism of copper oxides was discussed and the growth model of the semi-closed loop structure was proposed. We also found the semi-closed loop structure had a certain hindering effect on the intrusion of oxygen into the interior of the sintered silver, which slowed down the degradation of the strength of the sintered silver joint. The fracture mechanism of sintered nano-Ag joints during high temperature aging process was also studied.
KW - copper oxide
KW - high temperature reliability
KW - sintered silver joints
UR - https://www.scopus.com/pages/publications/85191748901
U2 - 10.1109/ICEPT59018.2023.10492408
DO - 10.1109/ICEPT59018.2023.10492408
M3 - 会议稿件
AN - SCOPUS:85191748901
T3 - 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
BT - 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th International Conference on Electronic Packaging Technology, ICEPT 2023
Y2 - 8 August 2023 through 11 August 2023
ER -