Microstructure and strength of the TiB2 cermet/TiAl joint diffusion bonded with Ni interlayer

Zhuoran Li; Jicai Feng; Jian Cao; Yiyu Qian

Microstructure and strength of the TiB₂ cermet/TiAl joint diffusion bonded with Ni interlayer

Zhuoran Li^*
, Jicai Feng
, Jian Cao
, Yiyu Qian

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

The vacuum diffusion bonding of TiB₂ cermet to TiAl-based alloys using Ni interlayer has been carried out at 1123-1323 K for 0.6-3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and their mechanical properties were investigated. The results showed that a TiAlNi₂ intermetallic layer and two Ti, Al, Ni solid solution layers were formed at the interface of Ni/TiAl. The shear strength was 110 MPa with the bonding temperature at 1223 K, the bonding time for 1.8 ks and the bonding pressure under 80 MPa.

Original language	English
Pages (from-to)	181-183
Number of pages	3
Journal	Journal of Materials Science and Technology
Volume	19
Issue number	SUPPL.
State	Published - Dec 2003

Keywords

Microstructure
Strength
TiAl
TiB

Cite this

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title = "Microstructure and strength of the TiB2 cermet/TiAl joint diffusion bonded with Ni interlayer",

abstract = "The vacuum diffusion bonding of TiB2 cermet to TiAl-based alloys using Ni interlayer has been carried out at 1123-1323 K for 0.6-3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and their mechanical properties were investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed at the interface of Ni/TiAl. The shear strength was 110 MPa with the bonding temperature at 1223 K, the bonding time for 1.8 ks and the bonding pressure under 80 MPa.",

keywords = "Microstructure, Strength, TiAl, TiB",

author = "Zhuoran Li and Jicai Feng and Jian Cao and Yiyu Qian",

year = "2003",

month = dec,

language = "英语",

volume = "19",

pages = "181--183",

journal = "Journal of Materials Science and Technology",

issn = "1005-0302",

publisher = "Chinese Society of Metals",

number = "SUPPL.",

}

TY - JOUR

T1 - Microstructure and strength of the TiB2 cermet/TiAl joint diffusion bonded with Ni interlayer

AU - Li, Zhuoran

AU - Feng, Jicai

AU - Cao, Jian

AU - Qian, Yiyu

PY - 2003/12

Y1 - 2003/12

N2 - The vacuum diffusion bonding of TiB2 cermet to TiAl-based alloys using Ni interlayer has been carried out at 1123-1323 K for 0.6-3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and their mechanical properties were investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed at the interface of Ni/TiAl. The shear strength was 110 MPa with the bonding temperature at 1223 K, the bonding time for 1.8 ks and the bonding pressure under 80 MPa.

AB - The vacuum diffusion bonding of TiB2 cermet to TiAl-based alloys using Ni interlayer has been carried out at 1123-1323 K for 0.6-3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and their mechanical properties were investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed at the interface of Ni/TiAl. The shear strength was 110 MPa with the bonding temperature at 1223 K, the bonding time for 1.8 ks and the bonding pressure under 80 MPa.

KW - Microstructure

KW - Strength

KW - TiAl

KW - TiB

UR - https://www.scopus.com/pages/publications/3242769200

M3 - 文章

AN - SCOPUS:3242769200

SN - 1005-0302

VL - 19

SP - 181

EP - 183

JO - Journal of Materials Science and Technology

JF - Journal of Materials Science and Technology

IS - SUPPL.

ER -

Microstructure and strength of the TiB₂ cermet/TiAl joint diffusion bonded with Ni interlayer

Abstract

Keywords

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