Microstructure and shape memory behavior of Ti55.5Ni44.5-xCux (x = 11.8-23.5) thin films

A. Ishida; M. Sato; Z. Y. Gao

doi:10.1016/j.intermet.2014.11.011

Microstructure and shape memory behavior of Ti_55.5Ni_44.5-xCu_x (x = 11.8-23.5) thin films

A. Ishida^*
, M. Sato
, Z. Y. Gao

^*Corresponding author for this work

National Institute for Materials Science Tsukuba

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

The microstructure and shape memory behavior of Ti_55.5Ni_45.5-xCu_x (x = 11.8-23.5) thin films annealed at 773, 873, and 973 K for 1 h were investigated. None of the films except the Ti_55.4Ni_32.8Cu_11.8 film annealed at 773 K for 1 h had any precipitates in the B2 grain interiors and their grain sizes were small (less than 1 μm). Increasing the annealing temperature caused grain growth and thus a decrease in the critical stress for slip and an increase in the martensitic transformation start temperature (Ms). The grain size was also controlled by the growth of a second phase. In the three-phase equilibrium region of Ti₂Ni, Ti₂Cu and TiNi, Ti₂Cu grains grew faster than Ti₂Ni grains, leading to a decrease in the critical stress for slip and an increase in the Ms temperature with increasing Cu content.

Original language	English
Pages (from-to)	103-108
Number of pages	6
Journal	Intermetallics
Volume	58
DOIs	https://doi.org/10.1016/j.intermet.2014.11.011
State	Published - Mar 2015
Externally published	Yes

Keywords

A. Shape-memory alloys
A. Thin films and multilayers
B. Martensitic transformation Shape-memory effects
C. Microstructure
G. MicroElectroMechanical (MEMS) and NanoElectroMechanical NEMS

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title = "Microstructure and shape memory behavior of Ti55.5Ni44.5-xCux (x = 11.8-23.5) thin films",

abstract = "The microstructure and shape memory behavior of Ti55.5Ni45.5-xCux (x = 11.8-23.5) thin films annealed at 773, 873, and 973 K for 1 h were investigated. None of the films except the Ti55.4Ni32.8Cu11.8 film annealed at 773 K for 1 h had any precipitates in the B2 grain interiors and their grain sizes were small (less than 1 μm). Increasing the annealing temperature caused grain growth and thus a decrease in the critical stress for slip and an increase in the martensitic transformation start temperature (Ms). The grain size was also controlled by the growth of a second phase. In the three-phase equilibrium region of Ti2Ni, Ti2Cu and TiNi, Ti2Cu grains grew faster than Ti2Ni grains, leading to a decrease in the critical stress for slip and an increase in the Ms temperature with increasing Cu content.",

keywords = "A. Shape-memory alloys, A. Thin films and multilayers, B. Martensitic transformation Shape-memory effects, C. Microstructure, G. MicroElectroMechanical (MEMS) and NanoElectroMechanical NEMS",

author = "A. Ishida and M. Sato and Gao, \{Z. Y.\}",

note = "Publisher Copyright: {\textcopyright} 2014 Published by Elsevier Ltd.",

year = "2015",

month = mar,

doi = "10.1016/j.intermet.2014.11.011",

language = "英语",

volume = "58",

pages = "103--108",

journal = "Intermetallics",

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T1 - Microstructure and shape memory behavior of Ti55.5Ni44.5-xCux (x = 11.8-23.5) thin films

AU - Ishida, A.

AU - Sato, M.

AU - Gao, Z. Y.

PY - 2015/3

Y1 - 2015/3

N2 - The microstructure and shape memory behavior of Ti55.5Ni45.5-xCux (x = 11.8-23.5) thin films annealed at 773, 873, and 973 K for 1 h were investigated. None of the films except the Ti55.4Ni32.8Cu11.8 film annealed at 773 K for 1 h had any precipitates in the B2 grain interiors and their grain sizes were small (less than 1 μm). Increasing the annealing temperature caused grain growth and thus a decrease in the critical stress for slip and an increase in the martensitic transformation start temperature (Ms). The grain size was also controlled by the growth of a second phase. In the three-phase equilibrium region of Ti2Ni, Ti2Cu and TiNi, Ti2Cu grains grew faster than Ti2Ni grains, leading to a decrease in the critical stress for slip and an increase in the Ms temperature with increasing Cu content.

AB - The microstructure and shape memory behavior of Ti55.5Ni45.5-xCux (x = 11.8-23.5) thin films annealed at 773, 873, and 973 K for 1 h were investigated. None of the films except the Ti55.4Ni32.8Cu11.8 film annealed at 773 K for 1 h had any precipitates in the B2 grain interiors and their grain sizes were small (less than 1 μm). Increasing the annealing temperature caused grain growth and thus a decrease in the critical stress for slip and an increase in the martensitic transformation start temperature (Ms). The grain size was also controlled by the growth of a second phase. In the three-phase equilibrium region of Ti2Ni, Ti2Cu and TiNi, Ti2Cu grains grew faster than Ti2Ni grains, leading to a decrease in the critical stress for slip and an increase in the Ms temperature with increasing Cu content.

KW - A. Shape-memory alloys

KW - A. Thin films and multilayers

KW - B. Martensitic transformation Shape-memory effects

KW - C. Microstructure

KW - G. MicroElectroMechanical (MEMS) and NanoElectroMechanical NEMS

UR - https://www.scopus.com/pages/publications/84919949276

U2 - 10.1016/j.intermet.2014.11.011

DO - 10.1016/j.intermet.2014.11.011

M3 - 文章

AN - SCOPUS:84919949276

SN - 0966-9795

VL - 58

SP - 103

EP - 108

JO - Intermetallics

JF - Intermetallics

ER -

Microstructure and shape memory behavior of Ti_55.5Ni_44.5-xCu_x (x = 11.8-23.5) thin films

Abstract

Keywords

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