Skip to main navigation Skip to search Skip to main content

Microstructure and properties of W-35wt%Cu powders composite consolidated by deformation strengthening

  • Yang Yu*
  • , Er De Wang
  • , Zu Yan Liu
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

In order to improve the densification of W-Cu composites, mechanical milling, liquid phase activation sintering, and hot hydrostatic extrusion technologies were used. Then advanced W-35wt.% Cu composites with dispersion microstructure were fabricated. Scanning electronics microscopy and electronics probe analysis were used. The results show that the deformation processed composite with high hardness and high electrical conductivity can be achieved by mechanical milling, liquid phase activation sintering, hot hydrostatic extrusion and vacuum heat-treatment at 800°C with holding time 2 hours. The maximum specific conductance of W-35wt.% Cu composites can reach 40 m/Ω·mm and the hardness is higher than 200 HB.

Original languageEnglish
Pages (from-to)645-648+653
JournalCailiao Kexue yu Gongyi/Material Science and Technology
Volume15
Issue number5
StatePublished - Oct 2007
Externally publishedYes

Keywords

  • Deformation strengthening
  • Hot hydrostatic extrusion
  • Liquid phase activation sintering
  • Mechanical milling
  • W-Cu composites

Fingerprint

Dive into the research topics of 'Microstructure and properties of W-35wt%Cu powders composite consolidated by deformation strengthening'. Together they form a unique fingerprint.

Cite this