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Microstructure and Properties of Cu-Mo Composites by EB-PVD

  • Xiao Li*
  • , Guangping Song
  • , Baiyang Lou
  • , Jiwen Wu
  • , Bin Xu
  • *Corresponding author for this work
  • Zhejiang University of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Mo particle reinforced copper composites with 2.5vol%~10.8vol% Mo were prepared by electron beam physical vapor deposition (EB-PVD). The microstructure, hardness and electrical resistivity were investigated. The results show that the Cu matrix is composed of columnar microcrystalline and the average grain size of Mo is 2.4~8.1 nm; the columnar crystal width of copper matrix decreases, while hardness and electrical resistivity of the composites increase with the increase of the Mo content. The strengthening mechanism of the composites by EB-PVD is mainly the Orowan mechanism.

Original languageEnglish
Pages (from-to)456-460
Number of pages5
JournalXiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
Volume46
Issue number2
StatePublished - 1 Feb 2017

Keywords

  • Copper matrix composites
  • EB-PVD
  • Nano-dispersion
  • Strengthening mechanism

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