Abstract
Mo particle reinforced copper composites with 2.5vol%~10.8vol% Mo were prepared by electron beam physical vapor deposition (EB-PVD). The microstructure, hardness and electrical resistivity were investigated. The results show that the Cu matrix is composed of columnar microcrystalline and the average grain size of Mo is 2.4~8.1 nm; the columnar crystal width of copper matrix decreases, while hardness and electrical resistivity of the composites increase with the increase of the Mo content. The strengthening mechanism of the composites by EB-PVD is mainly the Orowan mechanism.
| Original language | English |
|---|---|
| Pages (from-to) | 456-460 |
| Number of pages | 5 |
| Journal | Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering |
| Volume | 46 |
| Issue number | 2 |
| State | Published - 1 Feb 2017 |
Keywords
- Copper matrix composites
- EB-PVD
- Nano-dispersion
- Strengthening mechanism
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