Microstructure and performance of Al-Si alloy with high Si content by high temperature diffusion treatment

Zi Yang Xiu; Guo Qin Chen; Xiao Feng Wang; Gao Hui Wu; Yan Mei Liu; Wen Shu Yang

doi:10.1016/S1003-6326(09)60430-1

Microstructure and performance of Al-Si alloy with high Si content by high temperature diffusion treatment

Zi Yang Xiu^*
, Guo Qin Chen
, Xiao Feng Wang
, Gao Hui Wu
, Yan Mei Liu
, Wen Shu Yang

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

32 Scopus citations

Abstract

The Al-Si alloy with high Si content was prepared by pressure infiltration. Microstructure observation shows that three-dimensional structure (3D-structure) is obtained from irregular sharp Si particles via high temperature diffusion treatment (HTDT). Flat Si-Al interfaces transform to smooth curves, and Si phases precipitate in Al and Si-Al interface. The bonding of Si-Al interface is improved by HTDT, which improves the mechanical performance of Al-Si alloy. The bending strength of 3D-Al-Si alloy increases by 6 compared with that of Al-Si alloy, but the elastic modulus changes a little. The coefficient of thermal expansion (CTE) of the 3D-Al-Si alloy is 7.7×10^-6/°C from 20 °C to 100 °C, which decreases by 7 compared with that of Al-Si alloy. However, HTDT has little effect on the thermal conductivity of Al-Si alloy.

Original language	English
Pages (from-to)	2134-2138
Number of pages	5
Journal	Transactions of Nonferrous Metals Society of China (English Edition)
Volume	20
Issue number	11
DOIs	https://doi.org/10.1016/S1003-6326(09)60430-1
State	Published - Nov 2010
Externally published	Yes

Keywords

3D-structure
Al-Si alloy
diffusion
interface

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10.1016/S1003-6326(09)60430-1

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title = "Microstructure and performance of Al-Si alloy with high Si content by high temperature diffusion treatment",

abstract = "The Al-Si alloy with high Si content was prepared by pressure infiltration. Microstructure observation shows that three-dimensional structure (3D-structure) is obtained from irregular sharp Si particles via high temperature diffusion treatment (HTDT). Flat Si-Al interfaces transform to smooth curves, and Si phases precipitate in Al and Si-Al interface. The bonding of Si-Al interface is improved by HTDT, which improves the mechanical performance of Al-Si alloy. The bending strength of 3D-Al-Si alloy increases by 6 compared with that of Al-Si alloy, but the elastic modulus changes a little. The coefficient of thermal expansion (CTE) of the 3D-Al-Si alloy is 7.7×10-6/°C from 20 °C to 100 °C, which decreases by 7 compared with that of Al-Si alloy. However, HTDT has little effect on the thermal conductivity of Al-Si alloy.",

keywords = "3D-structure, Al-Si alloy, diffusion, interface",

author = "Xiu, \{Zi Yang\} and Chen, \{Guo Qin\} and Wang, \{Xiao Feng\} and Wu, \{Gao Hui\} and Liu, \{Yan Mei\} and Yang, \{Wen Shu\}",

year = "2010",

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doi = "10.1016/S1003-6326(09)60430-1",

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T1 - Microstructure and performance of Al-Si alloy with high Si content by high temperature diffusion treatment

AU - Xiu, Zi Yang

AU - Chen, Guo Qin

AU - Wang, Xiao Feng

AU - Wu, Gao Hui

AU - Liu, Yan Mei

AU - Yang, Wen Shu

PY - 2010/11

Y1 - 2010/11

N2 - The Al-Si alloy with high Si content was prepared by pressure infiltration. Microstructure observation shows that three-dimensional structure (3D-structure) is obtained from irregular sharp Si particles via high temperature diffusion treatment (HTDT). Flat Si-Al interfaces transform to smooth curves, and Si phases precipitate in Al and Si-Al interface. The bonding of Si-Al interface is improved by HTDT, which improves the mechanical performance of Al-Si alloy. The bending strength of 3D-Al-Si alloy increases by 6 compared with that of Al-Si alloy, but the elastic modulus changes a little. The coefficient of thermal expansion (CTE) of the 3D-Al-Si alloy is 7.7×10-6/°C from 20 °C to 100 °C, which decreases by 7 compared with that of Al-Si alloy. However, HTDT has little effect on the thermal conductivity of Al-Si alloy.

AB - The Al-Si alloy with high Si content was prepared by pressure infiltration. Microstructure observation shows that three-dimensional structure (3D-structure) is obtained from irregular sharp Si particles via high temperature diffusion treatment (HTDT). Flat Si-Al interfaces transform to smooth curves, and Si phases precipitate in Al and Si-Al interface. The bonding of Si-Al interface is improved by HTDT, which improves the mechanical performance of Al-Si alloy. The bending strength of 3D-Al-Si alloy increases by 6 compared with that of Al-Si alloy, but the elastic modulus changes a little. The coefficient of thermal expansion (CTE) of the 3D-Al-Si alloy is 7.7×10-6/°C from 20 °C to 100 °C, which decreases by 7 compared with that of Al-Si alloy. However, HTDT has little effect on the thermal conductivity of Al-Si alloy.

KW - 3D-structure

KW - Al-Si alloy

KW - diffusion

KW - interface

UR - https://www.scopus.com/pages/publications/78650119243

U2 - 10.1016/S1003-6326(09)60430-1

DO - 10.1016/S1003-6326(09)60430-1

M3 - 文章

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SN - 1003-6326

VL - 20

SP - 2134

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JO - Transactions of Nonferrous Metals Society of China (English Edition)

JF - Transactions of Nonferrous Metals Society of China (English Edition)

IS - 11

ER -

Microstructure and performance of Al-Si alloy with high Si content by high temperature diffusion treatment

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Keywords

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