Microstructure and microwave dielectric properties of 3D printed low loss Bi2Mo2O9 ceramics for LTCC applications

Athanasios Goulas; George Chi-Tangyie; Dawei Wang; Shiyu Zhang; Annapoorani Ketharam; Bala Vaidhyanathan; Ian M. Reaney; Darren A. Cadman; Will G. Whittow; John (Yiannis) C Y.C. Vardaxoglou; Daniel S. Engstrøm

doi:10.1016/j.apmt.2020.100862

Microstructure and microwave dielectric properties of 3D printed low loss Bi₂Mo₂O₉ ceramics for LTCC applications

Athanasios Goulas^*
, George Chi-Tangyie
, Dawei Wang
, Shiyu Zhang
, Annapoorani Ketharam
, Bala Vaidhyanathan
, Ian M. Reaney
, Darren A. Cadman
, Will G. Whittow
, John (Yiannis) C Y.C. Vardaxoglou
, Daniel S. Engstrøm

^*Corresponding author for this work

Loughborough University
University of Sheffield

Research output: Contribution to journal › Article › peer-review

31 Scopus citations

Abstract

Low sintering temperature, ultra-low loss microwave ceramics are envisaged as future dielectrics for fabricating low temperature co-fired ceramic (LTCC) components for 5G applications. Low sintering temperature bismuth molybdate β-Bi₂Mo₂O₉ ceramic powders have been synthesised using a solid-state reaction method. Their additive manufacture and resulting microwave properties are reported for the first time. Optimum densification occurred for 3D printed samples sintered 4 hours at 670°C which resulted in a maximum relative density (ρ_r) of 92%, relative permittivity (ε_r) of 34, dielectric loss (tanδ) of 0.0007, giving a microwave quality factor (Qxf) of 10,050 GHz, properties attractive for LTCC applications.

Original language	English
Article number	100862
Journal	Applied Materials Today
Volume	21
DOIs	https://doi.org/10.1016/j.apmt.2020.100862
State	Published - Dec 2020
Externally published	Yes

Keywords

3D printing
Additive manufacturing
BiMoO
Dielectrics
LTCC
Microwave ceramics

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10.1016/j.apmt.2020.100862

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Goulas, A., Chi-Tangyie, G., Wang, D., Zhang, S., Ketharam, A., Vaidhyanathan, B., Reaney, I. M., Cadman, D. A., Whittow, W. G., Vardaxoglou, JYC. Y. C., & Engstrøm, D. S. (2020). Microstructure and microwave dielectric properties of 3D printed low loss Bi₂Mo₂O₉ ceramics for LTCC applications. Applied Materials Today, 21, Article 100862. https://doi.org/10.1016/j.apmt.2020.100862

@article{973b141009f14c3eac0a4aa0c33715d1,

title = "Microstructure and microwave dielectric properties of 3D printed low loss Bi2Mo2O9 ceramics for LTCC applications",

abstract = "Low sintering temperature, ultra-low loss microwave ceramics are envisaged as future dielectrics for fabricating low temperature co-fired ceramic (LTCC) components for 5G applications. Low sintering temperature bismuth molybdate β-Bi2Mo2O9 ceramic powders have been synthesised using a solid-state reaction method. Their additive manufacture and resulting microwave properties are reported for the first time. Optimum densification occurred for 3D printed samples sintered 4 hours at 670°C which resulted in a maximum relative density (ρr) of 92\%, relative permittivity (εr) of 34, dielectric loss (tanδ) of 0.0007, giving a microwave quality factor (Qxf) of 10,050 GHz, properties attractive for LTCC applications.",

keywords = "3D printing, Additive manufacturing, BiMoO, Dielectrics, LTCC, Microwave ceramics",

author = "Athanasios Goulas and George Chi-Tangyie and Dawei Wang and Shiyu Zhang and Annapoorani Ketharam and Bala Vaidhyanathan and Reaney, \{Ian M.\} and Cadman, \{Darren A.\} and Whittow, \{Will G.\} and Vardaxoglou, \{John (Yiannis) C Y.C.\} and Engstr{\o}m, \{Daniel S.\}",

note = "Publisher Copyright: {\textcopyright} 2020 Elsevier Ltd",

year = "2020",

month = dec,

doi = "10.1016/j.apmt.2020.100862",

language = "英语",

volume = "21",

journal = "Applied Materials Today",

issn = "2352-9407",

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TY - JOUR

T1 - Microstructure and microwave dielectric properties of 3D printed low loss Bi2Mo2O9 ceramics for LTCC applications

AU - Goulas, Athanasios

AU - Chi-Tangyie, George

AU - Wang, Dawei

AU - Zhang, Shiyu

AU - Ketharam, Annapoorani

AU - Vaidhyanathan, Bala

AU - Reaney, Ian M.

AU - Cadman, Darren A.

AU - Whittow, Will G.

AU - Vardaxoglou, John (Yiannis) C Y.C.

AU - Engstrøm, Daniel S.

PY - 2020/12

Y1 - 2020/12

N2 - Low sintering temperature, ultra-low loss microwave ceramics are envisaged as future dielectrics for fabricating low temperature co-fired ceramic (LTCC) components for 5G applications. Low sintering temperature bismuth molybdate β-Bi2Mo2O9 ceramic powders have been synthesised using a solid-state reaction method. Their additive manufacture and resulting microwave properties are reported for the first time. Optimum densification occurred for 3D printed samples sintered 4 hours at 670°C which resulted in a maximum relative density (ρr) of 92%, relative permittivity (εr) of 34, dielectric loss (tanδ) of 0.0007, giving a microwave quality factor (Qxf) of 10,050 GHz, properties attractive for LTCC applications.

AB - Low sintering temperature, ultra-low loss microwave ceramics are envisaged as future dielectrics for fabricating low temperature co-fired ceramic (LTCC) components for 5G applications. Low sintering temperature bismuth molybdate β-Bi2Mo2O9 ceramic powders have been synthesised using a solid-state reaction method. Their additive manufacture and resulting microwave properties are reported for the first time. Optimum densification occurred for 3D printed samples sintered 4 hours at 670°C which resulted in a maximum relative density (ρr) of 92%, relative permittivity (εr) of 34, dielectric loss (tanδ) of 0.0007, giving a microwave quality factor (Qxf) of 10,050 GHz, properties attractive for LTCC applications.

KW - 3D printing

KW - Additive manufacturing

KW - BiMoO

KW - Dielectrics

KW - LTCC

KW - Microwave ceramics

UR - https://www.scopus.com/pages/publications/85094175662

U2 - 10.1016/j.apmt.2020.100862

DO - 10.1016/j.apmt.2020.100862

M3 - 文章

AN - SCOPUS:85094175662

SN - 2352-9407

VL - 21

JO - Applied Materials Today

JF - Applied Materials Today

M1 - 100862

ER -

Microstructure and microwave dielectric properties of 3D printed low loss Bi₂Mo₂O₉ ceramics for LTCC applications

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Keywords

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