Microstructural evolution of alloy powder for electronic materials with liquid miscibility gap

I. Ohnuma; T. Saegusa; Y. Takaku; C. P. Wang; X. J. Liu; R. Kainuma; K. Ishida

doi:10.1007/s11664-008-0537-x

Microstructural evolution of alloy powder for electronic materials with liquid miscibility gap

I. Ohnuma^*
, T. Saegusa
, Y. Takaku
, C. P. Wang
, X. J. Liu
, R. Kainuma
, K. Ishida

^*Corresponding author for this work

Tohoku University
Xiamen University

Research output: Contribution to journal › Article › peer-review

53 Scopus citations

Abstract

The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.

Original language	English
Pages (from-to)	2-9
Number of pages	8
Journal	Journal of Electronic Materials
Volume	38
Issue number	1
DOIs	https://doi.org/10.1007/s11664-008-0537-x
State	Published - Jan 2009
Externally published	Yes

Keywords

Liquid miscibility gap
Phase diagram
Powder
Thermodynamic calculation

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10.1007/s11664-008-0537-x

Cite this

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abstract = "The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.",

keywords = "Liquid miscibility gap, Phase diagram, Powder, Thermodynamic calculation",

author = "I. Ohnuma and T. Saegusa and Y. Takaku and Wang, \{C. P.\} and Liu, \{X. J.\} and R. Kainuma and K. Ishida",

year = "2009",

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AU - Ohnuma, I.

AU - Saegusa, T.

AU - Takaku, Y.

AU - Wang, C. P.

AU - Liu, X. J.

AU - Kainuma, R.

AU - Ishida, K.

PY - 2009/1

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AB - The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.

KW - Liquid miscibility gap

KW - Phase diagram

KW - Powder

KW - Thermodynamic calculation

UR - https://www.scopus.com/pages/publications/57649228422

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IS - 1

ER -

Microstructural evolution of alloy powder for electronic materials with liquid miscibility gap

Abstract

Keywords

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