Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints

He Zhao; Jian Cao; Jicai Feng

Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints

He Zhao^*
, Jian Cao
, Jicai Feng

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

The experimental investigation on the diffusion bonding of TC4 to ZQSn10-2-3 was carried out in vacuum. CuSn₃Ti₅, Cu₃Ti and rich-Pb layer were formed at the interface zone. The maximum joint strength was 102 MPa. Brittle fracture was explored after shear test, and occurred proximity to ZQSn10-2-3 side. Using copper as the interlayer, element Sn and Pb can be avoid diffusing from ZQSn10-2-3 to TC4. Then there were little CuSn₃Ti₅ in the interface. Fracture had certain plasticity, and the maximum strength of joint was 196 MPa. The optimum bonding parameters were: bonding temperature T = 830°C, bonding pressure p = 10 MPa and bonding time t = 30 min.

Original language	English
Pages (from-to)	37-40
Number of pages	4
Journal	Hanjie Xuebao/Transactions of the China Welding Institution
Volume	30
Issue number	7
State	Published - Jul 2009

Keywords

Copper interlayer
Diffusion bonding
Tin-bronze
Titanium alloy

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title = "Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints",

abstract = "The experimental investigation on the diffusion bonding of TC4 to ZQSn10-2-3 was carried out in vacuum. CuSn3Ti5, Cu3Ti and rich-Pb layer were formed at the interface zone. The maximum joint strength was 102 MPa. Brittle fracture was explored after shear test, and occurred proximity to ZQSn10-2-3 side. Using copper as the interlayer, element Sn and Pb can be avoid diffusing from ZQSn10-2-3 to TC4. Then there were little CuSn3Ti5 in the interface. Fracture had certain plasticity, and the maximum strength of joint was 196 MPa. The optimum bonding parameters were: bonding temperature T = 830°C, bonding pressure p = 10 MPa and bonding time t = 30 min.",

keywords = "Copper interlayer, Diffusion bonding, Tin-bronze, Titanium alloy",

author = "He Zhao and Jian Cao and Jicai Feng",

year = "2009",

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language = "英语",

volume = "30",

pages = "37--40",

journal = "Hanjie Xuebao/Transactions of the China Welding Institution",

issn = "0253-360X",

publisher = "Harbin Research Institute of Welding",

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TY - JOUR

T1 - Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints

AU - Zhao, He

AU - Cao, Jian

AU - Feng, Jicai

PY - 2009/7

Y1 - 2009/7

N2 - The experimental investigation on the diffusion bonding of TC4 to ZQSn10-2-3 was carried out in vacuum. CuSn3Ti5, Cu3Ti and rich-Pb layer were formed at the interface zone. The maximum joint strength was 102 MPa. Brittle fracture was explored after shear test, and occurred proximity to ZQSn10-2-3 side. Using copper as the interlayer, element Sn and Pb can be avoid diffusing from ZQSn10-2-3 to TC4. Then there were little CuSn3Ti5 in the interface. Fracture had certain plasticity, and the maximum strength of joint was 196 MPa. The optimum bonding parameters were: bonding temperature T = 830°C, bonding pressure p = 10 MPa and bonding time t = 30 min.

AB - The experimental investigation on the diffusion bonding of TC4 to ZQSn10-2-3 was carried out in vacuum. CuSn3Ti5, Cu3Ti and rich-Pb layer were formed at the interface zone. The maximum joint strength was 102 MPa. Brittle fracture was explored after shear test, and occurred proximity to ZQSn10-2-3 side. Using copper as the interlayer, element Sn and Pb can be avoid diffusing from ZQSn10-2-3 to TC4. Then there were little CuSn3Ti5 in the interface. Fracture had certain plasticity, and the maximum strength of joint was 196 MPa. The optimum bonding parameters were: bonding temperature T = 830°C, bonding pressure p = 10 MPa and bonding time t = 30 min.

KW - Copper interlayer

KW - Diffusion bonding

KW - Tin-bronze

KW - Titanium alloy

UR - https://www.scopus.com/pages/publications/68549122609

M3 - 文章

AN - SCOPUS:68549122609

SN - 0253-360X

VL - 30

SP - 37

EP - 40

JO - Hanjie Xuebao/Transactions of the China Welding Institution

JF - Hanjie Xuebao/Transactions of the China Welding Institution

IS - 7

ER -

Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints

Abstract

Keywords

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