Microscopic mechanism of stamping connection of 2024-SiC_P/2024 composites in semi-solid state

Authors prepares the gear with 2024-SiCP/2024 composites using compound forming technology combining with semi-solid die forging process and connection forming process. Mechanical tests show that the molding temperature at 630°C, under 400 MPa pressure the prepared gear tensile strength of the interface up to 240 MPa. By microscopic observation it shows that the molding temperature, molding pressure on the interfacial morphology, composition had a greater impact. Meanwhile, combining with the microstructure observation, it obtains the microscopic formation mechanism of 2024-SiCP/2024 composite semi-solid forging connections forming technology.