Micro-nano additive manufacturing for advanced electronic packaging of singulated chips

The high costs associated with frontend packaging services, coupled with the incompatibility of wafer-level backend technologies with singulated chips, present significant challenges to the development of high-performance semiconductor devices. Micro-nano additive manufacturing (AM) has emerged as a transformative solution for the packaging of singulated chip, offering customizable designs, rapid prototyping capabilities, and the fabrication of complex three-dimensional (3D) structures. This review highlights the pivotal role of micro-nano AM in the fabrication of 3D antennas, copper pillar micro-bumps, and redistribution layers (RDLs), while also addressing the challenges associated with heterogeneous integration and thermal management. By synergizing AM with conventional packaging techniques, this technology accelerates chip validation, reduces production costs, and enables multifunctional integration. Nevertheless, to realize its full potential at scale, AM still faces critical challenges such as limited scalability and structural consistency. This article provides a comprehensive overview of the integration of AM technologies into advanced electronic packaging, highlighting their potential to revolutionize next-generation semiconductor manufacturing and electronic integration.