@inproceedings{e50d647d92d249759809c2adc5612916,
title = "Micro-embossing process in ultrafine-grained pure aluminum processed by equal-channel angular pressing with elevated temperature",
abstract = "Micro-embossing tests were performed on ultrafine-grained pure Al processed by equal-channel angular pressing (ECAP) with 100 μm width of female die at different deformation temperature ranging from 298 K to 523 K under a force of 5 kN. The filling height, surface topography and microstructure of the cross section were measured by confocal scanning laser microscopy (CSLM), scanning electron microscopy (SEM) and electron backscattered diffraction (EBSD), respectively. The effects of deformation temperature on formability of ultrafine-grained (UFG) pure Al during micro-embossing were analyzed. The results show that increase in deformation temperature can improve the formability of UFG pure Al on micro-embossing. Micro hot embossing of UFG pure aluminum is characterized by the rib sidewall, surface quality, and fully transferred patterns, which shows ultrafine-grained pure Al has potential application in micro-forming.",
keywords = "ECAP, Micro-embossing, Micro-forming, Microstructure, Ultrafine-grained aluminum",
author = "Qian Su and Jie Xu and Lei Shi and Debin Shan and Bin Guo",
note = "Publisher Copyright: {\textcopyright} 2019 Trans Tech Publications Ltd, Switzerland.; 9th International Conference on Key Engineering Materials, ICKEM 2019 ; Conference date: 29-03-2019 Through 01-04-2019",
year = "2019",
doi = "10.4028/www.scientific.net/KEM.821.244",
language = "英语",
isbn = "9783035714807",
series = "Key Engineering Materials",
publisher = "Trans Tech Publications Ltd",
pages = "244--249",
editor = "Korsunsky, \{Alexander M.\}",
booktitle = "Key Engineering Materials IX",
address = "瑞士",
}