TY - GEN
T1 - Metallurgical behavior of Au/Al bond interface during high temperature storage of ultrasonic wedge bonding
AU - Mingyu, Li
AU - Song, Li
AU - Hongjun, Ji
PY - 2007
Y1 - 2007
N2 - Ultrasonic wedge bonding, which can be done at room temperature, is widely used in microelectronic package. It is primarily used to bond either Al wire or Au wire. After bonding and aging, the joint cross-section of 25μm Au wire bonded on Al metallization pad was analyzed by SEM with EDX. It is found that, there was evident diffusion of Au and Al, and Au5Al2 intermetallic compound (IMC) formed first after aging for 10 days at 200°C in atmosphere, and there was also some Au2Al formed at the edge of the interface. After aging for 20 days, the IMC developed slightly, and also Kirkendall voids generated at the interface. After aging for 30 days, the IMC began to transform to other Au-Al IMCs, and it became Au2Al IMC finally after aging for 40 days.
AB - Ultrasonic wedge bonding, which can be done at room temperature, is widely used in microelectronic package. It is primarily used to bond either Al wire or Au wire. After bonding and aging, the joint cross-section of 25μm Au wire bonded on Al metallization pad was analyzed by SEM with EDX. It is found that, there was evident diffusion of Au and Al, and Au5Al2 intermetallic compound (IMC) formed first after aging for 10 days at 200°C in atmosphere, and there was also some Au2Al formed at the edge of the interface. After aging for 20 days, the IMC developed slightly, and also Kirkendall voids generated at the interface. After aging for 30 days, the IMC began to transform to other Au-Al IMCs, and it became Au2Al IMC finally after aging for 40 days.
UR - https://www.scopus.com/pages/publications/34948817083
U2 - 10.1109/ICEPT.2006.359783
DO - 10.1109/ICEPT.2006.359783
M3 - 会议稿件
AN - SCOPUS:34948817083
SN - 142440620X
SN - 9781424406203
T3 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
BT - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
T2 - 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
Y2 - 26 August 2006 through 29 August 2006
ER -