Metallic electrical contact materials: DFT calculations, wetting mechanism and arc resistance

The interfacial wettability between reinforcing phases and metal matrices plays a crucial role in determining the arc damage behavior of metallic electrical contact materials. In recent years, significant progress has been achieved in optimizing wettability and developing contact materials with the deepening understanding of interfacial wetting mechanism. This article provides a comprehensive review of recent advancements in designing metallic electrical contact materials and addressing the issue of weak interfacial wettability. The classical sessile drop technique is a common strategy for evaluating the interfacial wettability, accompanied by a description of underlying wetting mechanism. Additionally, the interfacial properties of phase interfaces analyzed through first-principles calculations are discussed, highlighting the adhesion strength and electronic structures of the interfaces. Moreover, the connection between interfacial interaction and arc damage is established. Finally, personal perspectives are proposed, emphasizing the challenges and opportunities for design strategies of contact materials. This review can guide the future design directions for interfacial wettability and promote the development of metallic electrical contact materials.