Message from the Technical Program Chair and Co-Chairs

Cheng Wang; Qiang Cheng; Kuang Zhang; Lin Sheng Wu; Ming Chun Tang; Bing Zhang

doi:10.1109/IMWS-AMP57814.2023.10381049

Message from the Technical Program Chair and Co-Chairs

Cheng Wang
, Qiang Cheng
, Kuang Zhang
, Lin Sheng Wu
, Ming Chun Tang
, Bing Zhang

School of Electronics and Information Engineering

University of Electronic Science and Technology of China
Southeast University, Nanjing
Shanghai Jiao Tong University
Chongqing University
Sichuan University

Research output: Contribution to journal › Editorial

Original language	English
Journal	IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2023 - Proceedings
DOIs	https://doi.org/10.1109/IMWS-AMP57814.2023.10381049
State	Published - 2023
Event	2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2023 - Chengdu, China Duration: 12 Nov 2023 → 15 Nov 2023

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10.1109/IMWS-AMP57814.2023.10381049

Cite this

@article{826f8fdc9dc041dcaffb3290623b0607,

title = "Message from the Technical Program Chair and Co-Chairs",

author = "Cheng Wang and Qiang Cheng and Kuang Zhang and Wu, \{Lin Sheng\} and Tang, \{Ming Chun\} and Bing Zhang",

year = "2023",

doi = "10.1109/IMWS-AMP57814.2023.10381049",

language = "英语",

journal = "IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2023 - Proceedings",

note = "2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2023 ; Conference date: 12-11-2023 Through 15-11-2023",

}

TY - JOUR

T1 - Message from the Technical Program Chair and Co-Chairs

AU - Wang, Cheng

AU - Cheng, Qiang

AU - Zhang, Kuang

AU - Wu, Lin Sheng

AU - Tang, Ming Chun

AU - Zhang, Bing

PY - 2023

Y1 - 2023

UR - https://www.scopus.com/pages/publications/85183605633

U2 - 10.1109/IMWS-AMP57814.2023.10381049

DO - 10.1109/IMWS-AMP57814.2023.10381049

M3 - 社论

AN - SCOPUS:85183605633

JO - IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2023 - Proceedings

JF - IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2023 - Proceedings

T2 - 2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2023

Y2 - 12 November 2023 through 15 November 2023

ER -

Message from the Technical Program Chair and Co-Chairs

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