TY - GEN
T1 - Mechanism and control of linear positioning for IC wire bonders
AU - Li, Juan
AU - Liu, Yanjie
AU - Sun, Lining
AU - Jie, Degang
PY - 2005
Y1 - 2005
N2 - Chip packaging is an important process during IC manufacturing, which determines the IC productivity and performance to a great extent. Wire bonders are key equipments of chip packaging. The development trend of high performance wire bonders leads to the needs that the positioning stage, which is the basic component used in wire bonders, possess high dynamic performance and high steady precision. Currently the positioning stage consists of the parallel mechanism and direct-drive linear servomotors. This paper firstly reviews the current development of wire bonders, and investigates the performance of linear positioning used in wire bonders. Secondly, various advanced linear drive components are compared, and it is can be concluded that voice coil motor is the most ideal actuator in wire bonders. Finally, the control methods used in linear motors are investigated and their applicability is indicated respectively.
AB - Chip packaging is an important process during IC manufacturing, which determines the IC productivity and performance to a great extent. Wire bonders are key equipments of chip packaging. The development trend of high performance wire bonders leads to the needs that the positioning stage, which is the basic component used in wire bonders, possess high dynamic performance and high steady precision. Currently the positioning stage consists of the parallel mechanism and direct-drive linear servomotors. This paper firstly reviews the current development of wire bonders, and investigates the performance of linear positioning used in wire bonders. Secondly, various advanced linear drive components are compared, and it is can be concluded that voice coil motor is the most ideal actuator in wire bonders. Finally, the control methods used in linear motors are investigated and their applicability is indicated respectively.
UR - https://www.scopus.com/pages/publications/33846314320
U2 - 10.1109/ICEPT.2005.1564751
DO - 10.1109/ICEPT.2005.1564751
M3 - 会议稿件
AN - SCOPUS:33846314320
SN - 0780394496
SN - 9780780394490
T3 - 2005 6th International Conference on Electronics Packaging Technology
SP - 171
EP - 174
BT - 2005 6th International Conference on Electronics Packaging Technology
PB - IEEE Computer Society
T2 - 2005 6th International Conference on Electronics Packaging Technology
Y2 - 30 August 2005 through 2 September 2005
ER -