Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics

Yarong Chen; Zongpeng He; Zhenming Zhang; Meng Yang; Rong An

doi:10.1109/ICEPT.2014.6922668

Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics

Yarong Chen^*
, Zongpeng He
, Zhenming Zhang
, Meng Yang
, Rong An

^*Corresponding author for this work

Faculty of Life Sciences and Medicine

Beijing Spacecrafts

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have less voids and larger shearing strength. The Sn-3.0Ag-0.5Cu solder joint has the largest shear strength in all those 4 kinds of solders.

Original language	English
Title of host publication	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
Editors	Keyun Bi, Zhong Tian, Ziqiang Xu
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	340-342
Number of pages	3
ISBN (Electronic)	9781479947072
DOIs	https://doi.org/10.1109/ICEPT.2014.6922668
State	Published - 13 Oct 2014
Event	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 - Chengdu, China Duration: 12 Aug 2014 → 15 Aug 2014

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference	2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
Country/Territory	China
City	Chengdu
Period	12/08/14 → 15/08/14

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10.1109/ICEPT.2014.6922668

Cite this

Chen, Y., He, Z., Zhang, Z., Yang, M., & An, R. (2014). Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics. In K. Bi, Z. Tian, & Z. Xu (Eds.), 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 (pp. 340-342). Article 6922668 (Proceedings of the Electronic Packaging Technology Conference, EPTC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2014.6922668

Chen, Yarong ; He, Zongpeng ; Zhang, Zhenming et al. / Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics. 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. editor / Keyun Bi ; Zhong Tian ; Ziqiang Xu. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 340-342 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

@inproceedings{dbbbb4de08a8446396c37ef4ff3f40f4,

title = "Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics",

abstract = "The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have less voids and larger shearing strength. The Sn-3.0Ag-0.5Cu solder joint has the largest shear strength in all those 4 kinds of solders.",

author = "Yarong Chen and Zongpeng He and Zhenming Zhang and Meng Yang and Rong An",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",

year = "2014",

month = oct,

day = "13",

doi = "10.1109/ICEPT.2014.6922668",

language = "英语",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "340--342",

editor = "Keyun Bi and Zhong Tian and Ziqiang Xu",

booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",

address = "美国",

}

Chen, Y, He, Z, Zhang, Z, Yang, M & An, R 2014, Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics. in K Bi, Z Tian & Z Xu (eds), 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014., 6922668, Proceedings of the Electronic Packaging Technology Conference, EPTC, Institute of Electrical and Electronics Engineers Inc., pp. 340-342, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China, 12/08/14. https://doi.org/10.1109/ICEPT.2014.6922668

Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics. / Chen, Yarong; He, Zongpeng; Zhang, Zhenming et al.
2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. ed. / Keyun Bi; Zhong Tian; Ziqiang Xu. Institute of Electrical and Electronics Engineers Inc., 2014. p. 340-342 6922668 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics

AU - Chen, Yarong

AU - He, Zongpeng

AU - Zhang, Zhenming

AU - Yang, Meng

AU - An, Rong

PY - 2014/10/13

Y1 - 2014/10/13

N2 - The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have less voids and larger shearing strength. The Sn-3.0Ag-0.5Cu solder joint has the largest shear strength in all those 4 kinds of solders.

AB - The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have less voids and larger shearing strength. The Sn-3.0Ag-0.5Cu solder joint has the largest shear strength in all those 4 kinds of solders.

UR - https://www.scopus.com/pages/publications/84908085544

U2 - 10.1109/ICEPT.2014.6922668

DO - 10.1109/ICEPT.2014.6922668

M3 - 会议稿件

AN - SCOPUS:84908085544

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

SP - 340

EP - 342

BT - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014

A2 - Bi, Keyun

A2 - Tian, Zhong

A2 - Xu, Ziqiang

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014

Y2 - 12 August 2014 through 15 August 2014

ER -

Chen Y, He Z, Zhang Z, Yang M, An R. Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics. In Bi K, Tian Z, Xu Z, editors, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 340-342. 6922668. (Proceedings of the Electronic Packaging Technology Conference, EPTC). doi: 10.1109/ICEPT.2014.6922668

Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics

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