TY - GEN
T1 - Mechanical properties and microstructure of Sn-based solder joints at cryogenic temperature
AU - Du, Xue
AU - Tian, Yanhong
AU - Zhao, Xin
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/10/13
Y1 - 2014/10/13
N2 - This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints' mechanical properties, failure modes and failure mechanisms The results show that tensile strength of the solder joints increases first and then decreases along with the decreasing temperature, 63Sn37Pb/Cu and 62Sn36Pb2Ag/Ag joints reach their maximum strength at 173K and 223K respectively. Cryogenic temperature storage has no effect on IMC growing, but tin whisker is found in some parts of 63Sn37Pb/Cu and 62Sn36Pb2Ag/Cu solder joints stored for 10 days, without appearance in solder joints that stored for 20 days and those lead-free solder jonits. Sn whisker is random and unpredictable.
AB - This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints' mechanical properties, failure modes and failure mechanisms The results show that tensile strength of the solder joints increases first and then decreases along with the decreasing temperature, 63Sn37Pb/Cu and 62Sn36Pb2Ag/Ag joints reach their maximum strength at 173K and 223K respectively. Cryogenic temperature storage has no effect on IMC growing, but tin whisker is found in some parts of 63Sn37Pb/Cu and 62Sn36Pb2Ag/Cu solder joints stored for 10 days, without appearance in solder joints that stored for 20 days and those lead-free solder jonits. Sn whisker is random and unpredictable.
KW - cryogenic temperature
KW - mechanical properties
KW - tin whisker
UR - https://www.scopus.com/pages/publications/84908082624
U2 - 10.1109/ICEPT.2014.6922791
DO - 10.1109/ICEPT.2014.6922791
M3 - 会议稿件
AN - SCOPUS:84908082624
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 888
EP - 892
BT - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
A2 - Bi, Keyun
A2 - Tian, Zhong
A2 - Xu, Ziqiang
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
Y2 - 12 August 2014 through 15 August 2014
ER -