TY - GEN
T1 - Mechanical behaviors of shape memory polymer with linear monomer
AU - Zhou, Bo
AU - Wu, Xuelian
AU - Liu, Yanju
AU - Leng, Jinsong
PY - 2011
Y1 - 2011
N2 - The mechanical behaviors of epoxy-based shape memory polymer (SMP) with linear monomer at the temperatures of 25°C, 42°C, 56°C and 66°C are respectively investigated through the tension tests. Material parameter equations are supposed to describe the relationships between the material parameters of SMP with linear monomer and temperature. Numerical calculations show that the supposed material parameter equations well predict the relationships between the material parameters of SMP with linear monomer and temperature.
AB - The mechanical behaviors of epoxy-based shape memory polymer (SMP) with linear monomer at the temperatures of 25°C, 42°C, 56°C and 66°C are respectively investigated through the tension tests. Material parameter equations are supposed to describe the relationships between the material parameters of SMP with linear monomer and temperature. Numerical calculations show that the supposed material parameter equations well predict the relationships between the material parameters of SMP with linear monomer and temperature.
KW - Material parameter equation
KW - Mechanical behaviors
KW - Shape memory polymer
UR - https://www.scopus.com/pages/publications/79751493521
U2 - 10.4028/www.scientific.net/AMR.179-180.329
DO - 10.4028/www.scientific.net/AMR.179-180.329
M3 - 会议稿件
AN - SCOPUS:79751493521
SN - 9783037850169
T3 - Advanced Materials Research
SP - 329
EP - 333
BT - Materials Science and Engineering
T2 - 2010 International Conference on Materials Science and Engineering Science, ICMSES 2010
Y2 - 11 December 2010 through 12 December 2010
ER -