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Mechanical and electrical characteristics of screen printed stretchable circuits on thermoplastic polyurethane

  • S. H. Chen
  • , X. C. Shan
  • , W. L.R. Tang
  • , B. M. Mohaime
  • , M. H. Goh
  • , Z. W. Zhong
  • , J. Wei
  • Agency for Science, Technology and Research, Singapore
  • Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this research, we designed serpentine patterns of varying radii of curvature and the meander angle and screen printed the test coupons on thermoplastic polyurethane. The inks chosen were silver flake ink and carbon black ink. The test coupons are then subjected to destructive tensile testing while monitoring the change in resistance. The electrical characteristics are then used to determine the elastic limit of the test coupons and set the conditions for a cyclical test. The coupons were then tested to 1000 cycles. For the silver inks, it is found that the maximum strain at break is 42% and the best design for stretchability is at 22.5 degree meander angle. Detailed failure analysis shows the mechanical deformation is similar to bulk metal where dislocations propagate and crack through beyond the elastic limit in silver ink. Carbon ink, on the other hand, has a higher initial resistance but the maximum strain at break is 125.84%. It was found that for carbon ink the increase in resistance follows a consistent power law progression and the behavior is similar to diffusion based failure mechanisms We have thus provided an insight into the printing of stretchable circuits with conductive inks based on bulk mechanism and percolation mechanism and found that percolation brings about a big increase in the stretchability in the circuits.

Original languageEnglish
Title of host publication2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781538630426
DOIs
StatePublished - 2 Jul 2017
Externally publishedYes
Event2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, Singapore
Duration: 6 Dec 20179 Dec 2017

Publication series

Name2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
Volume2018-February

Conference

Conference2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Country/TerritorySingapore
CitySingapore
Period6/12/179/12/17

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