Measurement system for wafer bonding strength

Some measurement methods of wafer bonding strength were summarized. The principle of crack-opening method was analyzed and the system parameters and function were presented. A design idea was used to develope the testing system. Some key technique modules including precision positioning, micro-vision, IR measurement and control system are studied respectively. A wafer bonding strength measurement system are designed based on integrating all the modules. Finally, the feasibility of the system is tested by some contrast experiments with different bonding samples.