Measurement of Contact Pressure Distribution Map at Workpiece/tin Lap Interface and Process Parameters Optimization during Full-Aperture Polishing with Tin Lap

Contact pressure at the workpiece/tin lap interface during full-aperture polishing is of great significance to workpiece's material removal process. To promote the determinacy and efficiency of polishing process, a novel wireless contact pressure measurement system is developed. Further, the contact pressure distribution map is solved by the interpolation algorithm using the acquired contact pressure data at workpiece/ tin lap interface. Subsequently, a material removal amount model within given polishing time is proposed. Based on this model, process parameters are optimized with the genetic algorithms using contact pressure distribution map under specific workpiece's initial surface figure and polishing conditions. Compared with random process parameters, the optimized process parameters can greatly improve the accuracy and convergence efficiency of workpiece's surface figure in full-aperture polishing with tin lap, which is validated by the polishing experiments.