Material removal mechanism of multi-layer metal-film nanomilling

Yongda Yan; Jiqiang Wang; Yanquan Geng; Guoxiong Zhang

doi:10.1016/j.cirp.2022.03.040

Material removal mechanism of multi-layer metal-film nanomilling

Yongda Yan
, Jiqiang Wang
, Yanquan Geng^*
, Guoxiong Zhang

^*Corresponding author for this work

School of Mechatronics Engineering

Tianjin University

Research output: Contribution to journal › Article › peer-review

33 Scopus citations

Abstract

Tip-based nanomilling via atomic force microscopy enables alterable feature sizes for fabrication of substrates for surface-enhanced Raman scattering (SERS) with tunable plasmonic resonances. Specifically, nanomilling of SERS substrates on a multi-layer Au/Ag/Au film was investigated. The material removal mechanism at close-to-atomic scale, plastic deformation of the sample material, as well as the formation of nanogrooves were characterized. The Raman enhancement mechanism of the SERS substrate was revealed via simulations. This work thus provides a new method for preparing SERS substrates with tunable plasmonic resonances.

Original language	English
Pages (from-to)	61-64
Number of pages	4
Journal	CIRP Annals
Volume	71
Issue number	1
DOIs	https://doi.org/10.1016/j.cirp.2022.03.040
State	Published - Jan 2022

Keywords

Mechanism
Nano Manufacturing
Undeformed Chip Thickness (UCT)

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10.1016/j.cirp.2022.03.040

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title = "Material removal mechanism of multi-layer metal-film nanomilling",

abstract = "Tip-based nanomilling via atomic force microscopy enables alterable feature sizes for fabrication of substrates for surface-enhanced Raman scattering (SERS) with tunable plasmonic resonances. Specifically, nanomilling of SERS substrates on a multi-layer Au/Ag/Au film was investigated. The material removal mechanism at close-to-atomic scale, plastic deformation of the sample material, as well as the formation of nanogrooves were characterized. The Raman enhancement mechanism of the SERS substrate was revealed via simulations. This work thus provides a new method for preparing SERS substrates with tunable plasmonic resonances.",

keywords = "Mechanism, Nano Manufacturing, Undeformed Chip Thickness (UCT)",

author = "Yongda Yan and Jiqiang Wang and Yanquan Geng and Guoxiong Zhang",

note = "Publisher Copyright: {\textcopyright} 2022 CIRP",

year = "2022",

month = jan,

doi = "10.1016/j.cirp.2022.03.040",

language = "英语",

volume = "71",

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T1 - Material removal mechanism of multi-layer metal-film nanomilling

AU - Yan, Yongda

AU - Wang, Jiqiang

AU - Geng, Yanquan

AU - Zhang, Guoxiong

PY - 2022/1

Y1 - 2022/1

N2 - Tip-based nanomilling via atomic force microscopy enables alterable feature sizes for fabrication of substrates for surface-enhanced Raman scattering (SERS) with tunable plasmonic resonances. Specifically, nanomilling of SERS substrates on a multi-layer Au/Ag/Au film was investigated. The material removal mechanism at close-to-atomic scale, plastic deformation of the sample material, as well as the formation of nanogrooves were characterized. The Raman enhancement mechanism of the SERS substrate was revealed via simulations. This work thus provides a new method for preparing SERS substrates with tunable plasmonic resonances.

AB - Tip-based nanomilling via atomic force microscopy enables alterable feature sizes for fabrication of substrates for surface-enhanced Raman scattering (SERS) with tunable plasmonic resonances. Specifically, nanomilling of SERS substrates on a multi-layer Au/Ag/Au film was investigated. The material removal mechanism at close-to-atomic scale, plastic deformation of the sample material, as well as the formation of nanogrooves were characterized. The Raman enhancement mechanism of the SERS substrate was revealed via simulations. This work thus provides a new method for preparing SERS substrates with tunable plasmonic resonances.

KW - Mechanism

KW - Nano Manufacturing

KW - Undeformed Chip Thickness (UCT)

UR - https://www.scopus.com/pages/publications/85128669692

U2 - 10.1016/j.cirp.2022.03.040

DO - 10.1016/j.cirp.2022.03.040

M3 - 文章

AN - SCOPUS:85128669692

SN - 0007-8506

VL - 71

SP - 61

EP - 64

JO - CIRP Annals

JF - CIRP Annals

IS - 1

ER -

Material removal mechanism of multi-layer metal-film nanomilling

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Keywords

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