TY - GEN
T1 - Manufacture of hourglass-shaped solder joint by induction heating reflow
AU - Xu, Hongbo
AU - Li, Mingyu
AU - Zhang, Liqing
AU - Kim, Jongmyung
AU - Kim, Hongbae
PY - 2008
Y1 - 2008
N2 - Induction heating reflow method, which can achieve the solder bumping and interconnecting process in a simple way, was studied to control the height and shape of solder interconnects employed in electronic packaging application. A solder joint model was built to investigate the temperature distribution in the joint during the whole induction heating process by ANSYS software. Based on the simulation, the localized melting phenomenon is defined and identified by scanning electron microscope (SEM) observation. In this work, the barrel-shaped solder joints with high heights and the hourglass-shaped solder joints can be obtained which is useful to increase the solder joint lifetime. The mechanism of solder joint height and shape control, which can be explained by the local melt phenomenon, is discussed and demonstrated by the different morphologies of Ag3Sn intermetallic compound (IMC). The findings of this paper will help to provide an understanding of the whole solder interconnecting process during induction heating reflow and the effects of electromagnetic field on solder interconnect shape controlling.
AB - Induction heating reflow method, which can achieve the solder bumping and interconnecting process in a simple way, was studied to control the height and shape of solder interconnects employed in electronic packaging application. A solder joint model was built to investigate the temperature distribution in the joint during the whole induction heating process by ANSYS software. Based on the simulation, the localized melting phenomenon is defined and identified by scanning electron microscope (SEM) observation. In this work, the barrel-shaped solder joints with high heights and the hourglass-shaped solder joints can be obtained which is useful to increase the solder joint lifetime. The mechanism of solder joint height and shape control, which can be explained by the local melt phenomenon, is discussed and demonstrated by the different morphologies of Ag3Sn intermetallic compound (IMC). The findings of this paper will help to provide an understanding of the whole solder interconnecting process during induction heating reflow and the effects of electromagnetic field on solder interconnect shape controlling.
UR - https://www.scopus.com/pages/publications/52449098704
U2 - 10.1109/ICEPT.2008.4607053
DO - 10.1109/ICEPT.2008.4607053
M3 - 会议稿件
AN - SCOPUS:52449098704
SN - 9781424427406
T3 - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Y2 - 28 July 2008 through 31 July 2008
ER -