@inproceedings{dd32ea3aab754995b061e9be6eca247e,
title = "Low-temperature sintering of bimodal Ag nanoparticles for power electronics applications",
abstract = "The mechanism and morphological evolution of a thermal interface material prepared by pressureless sintering of a paste containing bimodal silver nanoparticles (AgNPs) were investigated. A high thermal conductivity (232 Wm-1K-1) was obtained from the material sintered at 250 °C for 30 min. These results could be ascribed to decrease of the defect densities and sintered densities of the sintered structures.",
keywords = "Ag nanoparticle, Bimodal, Sintering, Thermal conductivity",
author = "Yong Xiao and Yong Cao and Zhihao Zhang and Ming Yang and Shuai Wang and Mingyu Li",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 18th International Conference on Electronic Packaging Technology, ICEPT 2017 ; Conference date: 16-08-2017 Through 19-08-2017",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/ICEPT.2017.8046511",
language = "英语",
series = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "535--538",
editor = "Chenxi Wang and Yanhong Tian and Tianchun Ye",
booktitle = "18th International Conference on Electronic Packaging Technology, ICEPT 2017",
address = "美国",
}