Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Ying Zhong; Rong An; Chunqing Wang; Zhen Zheng; Zhi Quan Liu; Chin Hung Liu; Cai Fu Li; Tae Kyoung Kim; Sungho Jin

doi:10.1002/smll.201500896

Low Temperature Sintering Cu₆Sn₅ Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Ying Zhong
, Rong An
, Chunqing Wang^*
, Zhen Zheng
, Zhi Quan Liu
, Chin Hung Liu
, Cai Fu Li
, Tae Kyoung Kim
, Sungho Jin

^*Corresponding author for this work

Harbin Institute of Technology
CAS - Institute of Metal Research
University of California at San Diego

Research output: Contribution to journal › Article › peer-review

70 Scopus citations

Abstract

Brittle intermetallics such as Cu₆Sn₅ can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200°C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.

Original language	English
Pages (from-to)	4097-4103
Number of pages	7
Journal	Small
Volume	11
Issue number	33
DOIs	https://doi.org/10.1002/smll.201500896
State	Published - 1 Sep 2015

Keywords

TEM
high temperature interconnection
intermetallics
nanoparticles
sintering

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10.1002/smll.201500896

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title = "Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections",

abstract = "Brittle intermetallics such as Cu6Sn5 can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200°C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.",

keywords = "TEM, high temperature interconnection, intermetallics, nanoparticles, sintering",

author = "Ying Zhong and Rong An and Chunqing Wang and Zhen Zheng and Liu, \{Zhi Quan\} and Liu, \{Chin Hung\} and Li, \{Cai Fu\} and Kim, \{Tae Kyoung\} and Sungho Jin",

note = "Publisher Copyright: {\textcopyright} 2015 WILEY-VCH Verlag GmbH \& Co. KGaA, Weinheim.",

year = "2015",

month = sep,

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doi = "10.1002/smll.201500896",

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TY - JOUR

T1 - Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

AU - Zhong, Ying

AU - An, Rong

AU - Wang, Chunqing

AU - Zheng, Zhen

AU - Liu, Zhi Quan

AU - Liu, Chin Hung

AU - Li, Cai Fu

AU - Kim, Tae Kyoung

AU - Jin, Sungho

PY - 2015/9/1

Y1 - 2015/9/1

N2 - Brittle intermetallics such as Cu6Sn5 can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200°C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.

AB - Brittle intermetallics such as Cu6Sn5 can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200°C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.

KW - TEM

KW - high temperature interconnection

KW - intermetallics

KW - nanoparticles

KW - sintering

UR - https://www.scopus.com/pages/publications/84940790859

U2 - 10.1002/smll.201500896

DO - 10.1002/smll.201500896

M3 - 文章

AN - SCOPUS:84940790859

SN - 1613-6810

VL - 11

SP - 4097

EP - 4103

JO - Small

JF - Small

IS - 33

ER -

Low Temperature Sintering Cu₆Sn₅ Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

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Keywords

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