Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification

Wanqi Zhao; Panpan Lin; Tiesong Lin; Peng He; Yan Liu; Weimin Long; Jian Li

doi:10.1016/j.jmapro.2020.09.007

Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification

Wanqi Zhao
, Panpan Lin^*
, Tiesong Lin^*
, Peng He
, Yan Liu
, Weimin Long
, Jian Li

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Harbin Institute of Technology
CAS - Shanghai Institute of Ceramics
Zhengzhou Research Institute of Mechanical Engineering
Army Academy of Armored Forces

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

Owing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 °C has been successfully manufactured at 430 °C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces.

Original language	English
Pages (from-to)	1034-1038
Number of pages	5
Journal	Journal of Manufacturing Processes
Volume	58
DOIs	https://doi.org/10.1016/j.jmapro.2020.09.007
State	Published - Oct 2020

Keywords

Au-Si isothermal solidification
High temperature application
Nanocrystalline strengthened interface
Stacking faults

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10.1016/j.jmapro.2020.09.007

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title = "Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification",

abstract = "Owing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 °C has been successfully manufactured at 430 °C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces.",

keywords = "Au-Si isothermal solidification, High temperature application, Nanocrystalline strengthened interface, Stacking faults",

author = "Wanqi Zhao and Panpan Lin and Tiesong Lin and Peng He and Yan Liu and Weimin Long and Jian Li",

note = "Publisher Copyright: {\textcopyright} 2020 The Society of Manufacturing Engineers",

year = "2020",

month = oct,

doi = "10.1016/j.jmapro.2020.09.007",

language = "英语",

volume = "58",

pages = "1034--1038",

journal = "Journal of Manufacturing Processes",

issn = "1526-6125",

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TY - JOUR

T1 - Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification

AU - Zhao, Wanqi

AU - Lin, Panpan

AU - Lin, Tiesong

AU - He, Peng

AU - Liu, Yan

AU - Long, Weimin

AU - Li, Jian

PY - 2020/10

Y1 - 2020/10

N2 - Owing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 °C has been successfully manufactured at 430 °C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces.

AB - Owing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 °C has been successfully manufactured at 430 °C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces.

KW - Au-Si isothermal solidification

KW - High temperature application

KW - Nanocrystalline strengthened interface

KW - Stacking faults

UR - https://www.scopus.com/pages/publications/85090905170

U2 - 10.1016/j.jmapro.2020.09.007

DO - 10.1016/j.jmapro.2020.09.007

M3 - 文章

AN - SCOPUS:85090905170

SN - 1526-6125

VL - 58

SP - 1034

EP - 1038

JO - Journal of Manufacturing Processes

JF - Journal of Manufacturing Processes

ER -

Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification

Abstract

Keywords

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