Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

Gui sheng Gan; Tian Huang; Shi qi Chen; Liu jie Jiang; Da yong Cheng; Shu ye Zhang

doi:10.1016/j.memori.2023.100026

Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

Gui sheng Gan^*
, Tian Huang
, Shi qi Chen
, Liu jie Jiang
, Da yong Cheng
, Shu ye Zhang^*

^*Corresponding author for this work

School of Materials Science and Engineering

Chongqing Institute of Technology
Golden Dragon Precise Copper Tube Group Inc
Ltd

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

Composite solders of 1μm Zn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μm was used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu₅Zn₈, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints.

Original language	English
Article number	100026
Journal	Memories - Materials, Devices, Circuits and Systems
Volume	4
DOIs	https://doi.org/10.1016/j.memori.2023.100026
State	Published - Jul 2023

Keywords

Aging time
IMCs
Shear strength
Sn-0.3Ag-0.7Cu
Ultrasonic-assisted

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10.1016/j.memori.2023.100026

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@article{b5cdca85790a4ba0908eb55dcc959da8,

title = "Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders",

abstract = "Composite solders of 1μm Zn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μm was used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu5Zn8, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8\% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0\% compared with that of the as-received joints.",

keywords = "Aging time, IMCs, Shear strength, Sn-0.3Ag-0.7Cu, Ultrasonic-assisted",

author = "Gan, \{Gui sheng\} and Tian Huang and Chen, \{Shi qi\} and Jiang, \{Liu jie\} and Cheng, \{Da yong\} and Zhang, \{Shu ye\}",

note = "Publisher Copyright: {\textcopyright} 2023 The Author(s)",

year = "2023",

month = jul,

doi = "10.1016/j.memori.2023.100026",

language = "英语",

volume = "4",

journal = "Memories - Materials, Devices, Circuits and Systems",

issn = "2773-0646",

publisher = "Elsevier Ltd",

}

TY - JOUR

T1 - Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

AU - Gan, Gui sheng

AU - Huang, Tian

AU - Chen, Shi qi

AU - Jiang, Liu jie

AU - Cheng, Da yong

AU - Zhang, Shu ye

PY - 2023/7

Y1 - 2023/7

N2 - Composite solders of 1μm Zn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μm was used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu5Zn8, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints.

AB - Composite solders of 1μm Zn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25∼38μm was used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu5Zn8, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints.

KW - Aging time

KW - IMCs

KW - Shear strength

KW - Sn-0.3Ag-0.7Cu

KW - Ultrasonic-assisted

UR - https://www.scopus.com/pages/publications/85152438885

U2 - 10.1016/j.memori.2023.100026

DO - 10.1016/j.memori.2023.100026

M3 - 文章

AN - SCOPUS:85152438885

SN - 2773-0646

VL - 4

JO - Memories - Materials, Devices, Circuits and Systems

JF - Memories - Materials, Devices, Circuits and Systems

M1 - 100026

ER -

Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

Abstract

Keywords

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