@inproceedings{ef53ba115c0f4d91ac3e27223f5123b5,
title = "Low temperature direct metal bonding by self assembled monolayers",
abstract = "Elevated bonding temperature for interconnection deteriorates the reliability of both the device and the interconnect; hence the imperative for developing low temperature bonding methods. This study investigates the feasibility of using self-assembled monolayers (SAMs) to assist direct gold-gold (Au-Au) thermocompression bonding. This involves a simple molecular self-assembly process whereby a monolayer of alkyl chains with a sulfur end group is attached to the gold surface prior to bonding. Using this method, we have achieved Au-Au bonding at a bonding temperature below 100°C, a significant reduction compared to the conventional bonding temperatures of above 150°C We attribute this temperature reduction to two properties of SAMs - (1) surface passivation of the Au surface that precludes adsorption of surface contaminants, and (2) the easy displacement of SAMs through thermal desorption just before bonding occurs. This SAMs-assisted bonding mechanism is supported by X-ray photoelectron spectroscopy (XPS) and surface plasmon resonance (SPR) results.",
author = "Xiaofang Ang and Chin, \{Li Cheong\} and Zhang, \{Guo Ge\} and Jun Wei and Zhong Chen and Wong, \{Chee Cheong\}",
year = "2007",
doi = "10.1557/proc-0990-b10-03",
language = "英语",
isbn = "9781558999503",
series = "Materials Research Society Symposium Proceedings",
publisher = "Materials Research Society",
pages = "287--293",
booktitle = "Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics",
note = "2007 MRS Spring Meeting ; Conference date: 10-04-2007 Through 12-04-2007",
}