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Low-temperature bonded glass-membrane microfluidic device for in vitro organ-on-a-chip cell culture models

  • Kyall J. Pocock
  • , Xiaofang Gao
  • , Chenxi Wang
  • , Craig Priest
  • , Clive A. Prestidge
  • , Kazuma Mawatari
  • , Takehiko Kitamori
  • , Benjamin Thierry
  • University of South Australia
  • The University of Tokyo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The integration of microfluidics with living biological systems has paved the way to the exciting concept of 'organson-a-chip', which aims at the development of advanced in vitro models that replicate the key features of human organs. Glass based devices have long been utilised in the field of microfluidics but the integration of alternative functional elements within multi-layered glass microdevices, such as polymeric membranes, remains a challenge. To this end, we have extended a previously reported approach for the low-temperature bonding of glass devices that enables the integration of a functional polycarbonate porous membrane. The process was initially developed and optimised on specialty low-temperature bonding equipment (μTAS2001, Bondtech, Japan) and subsequently adapted to more widely accessible hot embosser units (EVG520HE Hot Embosser, EVG, Austria). The key aspect of this method is the use of low temperatures compatible with polymeric membranes. Compared to borosilicate glass bonding (650 °C) and quartz/fused silica bonding (1050 °C) processes, this method maintains the integrity and functionality of the membrane (Tg 150 °C for polycarbonate). Leak tests performed showed no damage or loss of integrity of the membrane for up to 150 hours, indicating sufficient bond strength for long term cell culture. A feasibility study confirmed the growth of dense and functional monolayers of Caco-2 cells within 5 days.

Original languageEnglish
Title of host publicationMicro+Nano Materials, Devices, and Systems
EditorsStefano Palomba, Benjamin J. Eggleton
PublisherSPIE
ISBN (Electronic)9781628418903
DOIs
StatePublished - 2015
EventSPIE Micro+Nano Materials, Devices, and Applications Symposium - Sydney, Australia
Duration: 6 Dec 20159 Dec 2015

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9668
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceSPIE Micro+Nano Materials, Devices, and Applications Symposium
Country/TerritoryAustralia
CitySydney
Period6/12/159/12/15

Keywords

  • cell co-culture
  • intestine-on-a-chip
  • low temperature bonding
  • microfluidics
  • organ-on-a-chip

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