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Low power multilevel current-mode interconnect system with RLC model

  • Xinsheng Wang*
  • , Liang Han
  • , Mingyan Yu
  • *Corresponding author for this work
  • Harbin Institute of Technology Weihai
  • Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, we introduce a novel multi-level current mode for RLC interconnection system, which can effectively reduce the delay on the interconnect line and consume low power over long interconnect line. Interconnect wire inductance can decrease interconnect power and affect interconnect system frequency, while the technology of inductive peaking, which counteracts the high frequency attenuation due to the capacitance, will still work well. Simulation results show that the power consumption of the RLC interconnect system is 172uW, which is improved 100 times more than voltage mode buffer insertion techniques and lower than other current mode interconnect systems. Moreover interconnect wire power is also reducing over 6.6% due to interconnect inductance effect in 1mm interconnect wire.

Original languageEnglish
Title of host publicationIET International Conference on Information Science and Control Engineering 2012, ICISCE 2012
Edition636 CP
DOIs
StatePublished - 2012
EventIET International Conference on Information Science and Control Engineering 2012, ICISCE 2012 - Shenzhen, China
Duration: 7 Dec 20129 Dec 2012

Publication series

NameIET Conference Publications
Number636 CP
Volume2012

Conference

ConferenceIET International Conference on Information Science and Control Engineering 2012, ICISCE 2012
Country/TerritoryChina
CityShenzhen
Period7/12/129/12/12

Keywords

  • Current mode
  • Integrated circuit
  • Interconnect inductance
  • Low power
  • Multilevel signaling

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