Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

H. Y. Jing; Y. Y. Zhang; L. Y. Xu; G. S. Zhang; Y. D. Han; J. Wei

doi:10.1016/j.ijfatigue.2015.02.005

Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

H. Y. Jing
, Y. Y. Zhang
, L. Y. Xu^*
, G. S. Zhang
, Y. D. Han
, J. Wei

^*Corresponding author for this work

Tianjin University
Tianjin Key Laboratory of Advanced Joining Technology
Agency for Science, Technology and Research, Singapore

Research output: Contribution to journal › Article › peer-review

13 Scopus citations

Abstract

The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.

Original language	English
Pages (from-to)	100-107
Number of pages	8
Journal	International Journal of Fatigue
Volume	75
DOIs	https://doi.org/10.1016/j.ijfatigue.2015.02.005
State	Published - Jun 2015
Externally published	Yes

Keywords

Coffin-Manson model
Eutectic 80Au/20Sn solder alloy
Failure mechanism
Low cycle fatigue
Morrow model

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10.1016/j.ijfatigue.2015.02.005

Cite this

@article{6d132468c4ad47afbac5043d23df1b5e,

title = "Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy",

abstract = "The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.",

keywords = "Coffin-Manson model, Eutectic 80Au/20Sn solder alloy, Failure mechanism, Low cycle fatigue, Morrow model",

author = "Jing, \{H. Y.\} and Zhang, \{Y. Y.\} and Xu, \{L. Y.\} and Zhang, \{G. S.\} and Han, \{Y. D.\} and J. Wei",

year = "2015",

month = jun,

doi = "10.1016/j.ijfatigue.2015.02.005",

language = "英语",

volume = "75",

pages = "100--107",

journal = "International Journal of Fatigue",

issn = "0142-1123",

publisher = "Elsevier Ltd",

}

TY - JOUR

T1 - Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

AU - Jing, H. Y.

AU - Zhang, Y. Y.

AU - Xu, L. Y.

AU - Zhang, G. S.

AU - Han, Y. D.

AU - Wei, J.

PY - 2015/6

Y1 - 2015/6

N2 - The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.

AB - The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.

KW - Coffin-Manson model

KW - Eutectic 80Au/20Sn solder alloy

KW - Failure mechanism

KW - Low cycle fatigue

KW - Morrow model

UR - https://www.scopus.com/pages/publications/84924368789

U2 - 10.1016/j.ijfatigue.2015.02.005

DO - 10.1016/j.ijfatigue.2015.02.005

M3 - 文章

AN - SCOPUS:84924368789

SN - 0142-1123

VL - 75

SP - 100

EP - 107

JO - International Journal of Fatigue

JF - International Journal of Fatigue

ER -

Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

Abstract

Keywords

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