TY - GEN
T1 - Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction
AU - Li, Zhuolin
AU - Li, Mingyu
AU - Kim, Jongmyung
AU - Kim, Hongbae
PY - 2012
Y1 - 2012
N2 - The intense generation of frictional heat in fast rubbing process can locally melt contacting solids and join materials. This letter decribes a localized heating and soldering at solder/Cu interface induced by ultrasonic friction. Through probing the mean surface temperature of sliding solder bump, the transient nature of frictional heat generation can be deduced, which is associated with the interfacial thermo-mechanical interaction during ultrasonic slip. A thin molten solder film forms at the frictional interface and reacts with the Cu top surface metallization (TSM) pad, producing nano-scale Cu 6Sn5 intermetallic compounds (IMCs), with some tiny Ag3Sn particles attaching on them. The effects of ultrasonic sound on the interfacial reaction of IMCs were investigated, and the shear strengths of ultrasonic-soldered joints with different bonding times were also characterized.
AB - The intense generation of frictional heat in fast rubbing process can locally melt contacting solids and join materials. This letter decribes a localized heating and soldering at solder/Cu interface induced by ultrasonic friction. Through probing the mean surface temperature of sliding solder bump, the transient nature of frictional heat generation can be deduced, which is associated with the interfacial thermo-mechanical interaction during ultrasonic slip. A thin molten solder film forms at the frictional interface and reacts with the Cu top surface metallization (TSM) pad, producing nano-scale Cu 6Sn5 intermetallic compounds (IMCs), with some tiny Ag3Sn particles attaching on them. The effects of ultrasonic sound on the interfacial reaction of IMCs were investigated, and the shear strengths of ultrasonic-soldered joints with different bonding times were also characterized.
UR - https://www.scopus.com/pages/publications/84880312104
U2 - 10.1109/EMAP.2012.6507863
DO - 10.1109/EMAP.2012.6507863
M3 - 会议稿件
AN - SCOPUS:84880312104
SN - 9781467349444
T3 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
BT - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
T2 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
Y2 - 13 December 2012 through 16 December 2012
ER -