Skip to main navigation Skip to search Skip to main content

Layer by layer graphite film reinforced aluminum composites with an enhanced performance of thermal conduction in the thermal management applications

  • Jing Chang
  • , Qiang Zhang*
  • , Yingfei Lin
  • , Gaohui Wu
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Layer by layer aluminum matrix composites with an outstanding thermal conductivity reinforced with the graphite films were fabricated through pressure infiltration process. Three different types of graphite films were characterized and studied as the reinforcement candidates in preparation of aluminum composites. In order to obtain comprehensive excellent conductive composites, several kinds of aluminum alloy matrix were applied in the preparation process. Scanning electron microscopy, X-ray diffraction, Raman spectroscopy and optical microscopy were used to evaluate the graphite films and laminated composites. The interlayer shear strength and thermal physical properties of the graphite film reinforced aluminum composites were studied. The results revealed that graphite films and aluminum alloy were layered alternately distributed and no interfacial reaction products were observed. The graphite films reinforced pure Al composites showed a relatively low coefficient of thermal expansion and an enhanced heat conductive performance with a thermal conductivity of 743 W/(m·k).

Original languageEnglish
Pages (from-to)601-609
Number of pages9
JournalJournal of Alloys and Compounds
Volume742
DOIs
StatePublished - 25 Apr 2018
Externally publishedYes

Keywords

  • Aluminum
  • Graphite films
  • Laminated structure
  • Pressure infiltration
  • Thermal conductivity

Fingerprint

Dive into the research topics of 'Layer by layer graphite film reinforced aluminum composites with an enhanced performance of thermal conduction in the thermal management applications'. Together they form a unique fingerprint.

Cite this