Laser machining micro-structures on diamond surface with a sub-nanosecond pulsed laser

Micro-structure surface on diamond material is widely used in a series of industrial and scientific applications, such as micro-electromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics, textured or micro-structured diamond machining tools. The efficient machining of micro-structure on diamond surface is urgently demanded in engineering. In this paper, laser machining square micro-structure on diamond surface was studied with a sub-nanosecond pulsed laser. The influences of laser machining parameters, including the laser power, scanning speed, defocusing quantity and scanning pitch, were researched in view of the ablation depth, material removal rate and machined surface topography. Both the ablation depth and material removal rate increased with average laser power. A reduction of the growth rate of the two parameters was induced by the absorption of the laser plasma plume at high laser power. The ablation depth non-linearly decreased with the increasing of the scanning speed while the material removal rate showed an opposite tendency. The increasing of the defocusing quantity induced complex variation of the ablation depth and the material removal rate. The maximum ablation depth and material removal rate were achieved at a defocusing position. The ablation depth and material removal rate oppositely varied about the scanning pitch. A high overlap ratio was meaningful for achieving a smooth micro-structure surface topography. Laser machining with a large defocusing quantity, high laser power and small scanning pitch was helpful for acquiring the desired micro-structure which had a large depth and smooth micro-structure surface topography.