Large-scale fabrication of graphene/SiC composites with integrated electromagnetic interference shielding and thermal conductivity properties

With the widespread adoption of smart devices, the increasing power, integration, and miniaturization of electronic equipment have led to escalating issues of electromagnetic interference and overheating. Consequently, the mass production of materials that combine electromagnetic interference (EMI) shielding with thermal management capabilities has become particularly crucial. This study primarily employs an industrially scalable fabrication method, utilizing graphene oxide filter cake as the raw material and introducing silicon carbide (SiC) fibers as bridges between graphene layers. The SiC nanofibers were gradually anchored on the graphene layer, thereby enhancing the EMI shielding effectiveness and thermal conductivity of the graphene-based composite. The results indicate that the composite material achieves a thermal conductivity of 223.9 W·m⁻¹ ·K⁻¹ and an EMI shielding effectiveness of 84.1 dB, when the SiC content is 1.0 %. These findings demonstrate that the graphene/SiC composite film exhibits excellent thermal conductivity and EMI shielding performance, highlighting its potential application in EMI shielding and thermal management for microelectronics.