Kinetic study of electroless copper with glycine as complexing agent

D. Y. Li; N. Li; N. Xiao; Z. Y. Zhu; F. F. Wang

doi:10.14233/ajchem.2013.13714

Kinetic study of electroless copper with glycine as complexing agent

D. Y. Li
, N. Li^*
, N. Xiao
, Z. Y. Zhu
, F. F. Wang

^*Corresponding author for this work

School of Chemistry and Chemical Engineering, Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

In this work, the effect of Cu²⁺, Ni²⁺, glycine, sodium hypophosphite, pH value and temperature on the deposition velocity was studied by weight method. In addition, the deposition rate equation was calculated in the system using glycine as the complexing agent and sodium hypophosphite as the reducing agent.

Original language	English
Pages (from-to)	3679-3681
Number of pages	3
Journal	Asian Journal of Chemistry
Volume	25
Issue number	7
DOIs	https://doi.org/10.14233/ajchem.2013.13714
State	Published - 2013
Externally published	Yes

Keywords

Electroless copper plating
Glycine
Rate equation
Sodium hypophosphite

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10.14233/ajchem.2013.13714

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@article{801dac1950014c239b477f4eae44799e,

title = "Kinetic study of electroless copper with glycine as complexing agent",

abstract = "In this work, the effect of Cu2+, Ni2+, glycine, sodium hypophosphite, pH value and temperature on the deposition velocity was studied by weight method. In addition, the deposition rate equation was calculated in the system using glycine as the complexing agent and sodium hypophosphite as the reducing agent.",

keywords = "Electroless copper plating, Glycine, Rate equation, Sodium hypophosphite",

author = "Li, \{D. Y.\} and N. Li and N. Xiao and Zhu, \{Z. Y.\} and Wang, \{F. F.\}",

year = "2013",

doi = "10.14233/ajchem.2013.13714",

language = "英语",

volume = "25",

pages = "3679--3681",

journal = "Asian Journal of Chemistry",

issn = "0970-7077",

publisher = "Asian Publication Corporation",

number = "7",

}

TY - JOUR

T1 - Kinetic study of electroless copper with glycine as complexing agent

AU - Li, D. Y.

AU - Li, N.

AU - Xiao, N.

AU - Zhu, Z. Y.

AU - Wang, F. F.

PY - 2013

Y1 - 2013

N2 - In this work, the effect of Cu2+, Ni2+, glycine, sodium hypophosphite, pH value and temperature on the deposition velocity was studied by weight method. In addition, the deposition rate equation was calculated in the system using glycine as the complexing agent and sodium hypophosphite as the reducing agent.

AB - In this work, the effect of Cu2+, Ni2+, glycine, sodium hypophosphite, pH value and temperature on the deposition velocity was studied by weight method. In addition, the deposition rate equation was calculated in the system using glycine as the complexing agent and sodium hypophosphite as the reducing agent.

KW - Electroless copper plating

KW - Glycine

KW - Rate equation

KW - Sodium hypophosphite

UR - https://www.scopus.com/pages/publications/84875165290

U2 - 10.14233/ajchem.2013.13714

DO - 10.14233/ajchem.2013.13714

M3 - 文章

AN - SCOPUS:84875165290

SN - 0970-7077

VL - 25

SP - 3679

EP - 3681

JO - Asian Journal of Chemistry

JF - Asian Journal of Chemistry

IS - 7

ER -

Kinetic study of electroless copper with glycine as complexing agent

Abstract

Keywords

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