@inproceedings{2ab095fb6d9b4672a7a5538f784aa02f,
title = "Kinetic Monte Carlo study of void distribution in nickel thin film by physical vapor deposition",
abstract = "2D kinetic Monte Carlo simulation has been used to study the void distribution of nickel thin film prepared by physical vapor deposition, and embedded atom method (EAM) was used to represent the interatomic interaction. Packing density and surface roughness were studied as the functions of deposition rate, substrate temperature and incident angle. The results reveal the existence of critical substrate temperature and critical incident angle, and higher substrate temperature, lower deposition rate and appropriate incident angle are advantaged to prepare the compact thin film with excellent mechanical properties.",
keywords = "Kinetic Monte Carlo, PVD, Thin film, Void",
author = "He, \{X. D.\} and Shan, \{Y. C.\} and Li, \{M. W.\}",
year = "2007",
doi = "10.4028/3-908451-30-2.1153",
language = "英语",
isbn = "3908451302",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications Ltd",
number = "PART 2",
pages = "1153--1156",
booktitle = "Nanoscience and Technology",
address = "瑞士",
edition = "PART 2",
note = "China International Conference on Nanoscience and Technology, ChinaNANO 2005 ; Conference date: 09-06-2005 Through 11-06-2005",
}