Joining of C_f/SiC composites and Si₃N₄ ceramic with Y₂O₃–Al₂O₃–SiO₂ glass filler for high-temperature applications

C_f/SiC composites and Si₃N₄ ceramics are candidate materials for applications in thermal protection system. This paper investigated the joining of C_f/SiC and Si₃N₄ using Y₂O₃–Al₂O₃–SiO₂ glass. The reliability of joints was evaluated by thermal shock tests. In this present work, the typical joint structure was C_f/SiC-glass-Si₃N₄. The results demonstrate that Direct bonding has been identified as the interfacial bonding mechanism at the SiC/glass and glass/Si₃N₄ interfaces. The maximum shear strength of the C_f/SiC–Si₃N₄ joint was ~34 MPa, which delivered an effective method to achieve strong, reliable bonding between the dissimilar materials. In addition, after thermal shock for 10 cycles, the residual strength remained ~13 MPa. Bubbles instead of microcracks formed in the glass filler, which was the main factor causing the degradation of the joint performance. It is suggested that improving the high temperature resistance of joining materials is the key to realize the application of this joint structure.