Abstract
Methods of measuring the thickness of ultra-thin DLC film and Si interlayer were investigated by AES, XPS, TEM in present paper. The results of XPS and AES are consistent with each other, but a discrepancy existed between them and TEM. Clearing interface of DLC and Si layers can't be observed in HRTEM image. Furthermore, what led the different measured thickness among above three methods were investigated.
| Original language | English |
|---|---|
| Pages (from-to) | 28-30 |
| Number of pages | 3 |
| Journal | Journal of Materials Engineering |
| Issue number | SUPPL. |
| State | Published - Jul 2006 |
Keywords
- AES
- TEM
- Thickness
- Ultra-thin DLC
- XPS
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